Study of Reactive Wetting of Sn–0.7Cu and Sn–0.3Ag–0.7Cu Lead Free Solders during Solidification on Nickel Coated Al Substrates
Microstructure, wetting behavior and interfacial
reactions between Sn–0.7Cu and Sn–0.3Ag–0.7Cu (SAC0307)
solders solidified on Ni coated Al substrates were compared and
investigated. Microstructure of Sn–0.7Cu alloy exhibited a eutectic
matrix composed of primary β-Sn dendrites with a fine dispersion of
Cu6Sn5 intermetallics whereas microstructure of SAC0307 alloy
exhibited coarser Cu6Sn5 and finer Ag3Sn precipitates of IMCs with
decreased tin dendrites. Contact angles ranging from 22° to 26° were
obtained for Sn–0.7Cu solder solidified on substrate surface whereas
for SAC0307 solder alloy contact angles were found to be in the
range of 20° to 22°. Sn–0.7Cu solder/substrate interfacial region
exhibited faceted (Cu, Ni)6Sn5 IMCs protruding into the solder matrix
and a small amount of (Cu, Ni)3Sn4 intermetallics at the interface.
SAC0307 solder/substrate interfacial region showed mainly (Cu,
Ni)3Sn4 intermetallics adjacent to the coating layer and (Cu,
Ni)6Sn5 IMCs in the solder matrix. The improvement in the
wettability of SAC0307 solder alloy on substrate surface is attributed
to the formation of cylindrical shape (Cu,Ni)6Sn5 and a layer of
(Cu, Ni)3Sn4 IMCs at the interface.
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