Wetting Behavior of Reactive and Non–Reactive Wetting of Liquids on Metallic Substrates
Wetting characteristics of reactive (Sn–0.7Cu solder)
and non– reactive (castor oil) wetting of liquids on Cu and Ag plated
Al substrates have been investigated. Solder spreading exhibited
capillary, gravity and viscous regimes. Oils did not exhibit noticeable
spreading regimes. Solder alloy showed better wettability on Ag
coated Al substrate compared to Cu plating. In the case of castor oil,
Cu coated Al substrate exhibited good wettability as compared to Ag
coated Al substrates. The difference in wettability during reactive
wetting of solder and non–reactive wetting of oils is attributed to the
change in the surface energies of Al substrates brought about by the
formation of intermetallic compounds (IMCs).
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