Open Science Research Excellence
Shazlin, S. , Nurulakmal, M.. "Evaluation of Alloying Additions on the Microstructure and IMC Formation of Sn-Ag-Cu Solder on Cu and Ni (P) Substrates". World Academy of Science, Engineering and Technology, International Science Index 60, International Journal of Chemical, Molecular, Nuclear, Materials and Metallurgical Engineering (2011), 5(12), 1091 - 1095.