Open Science Research Excellence
S.O. Shazlin and  M.S. Nurulakmal,  Evaluation of Alloying Additions on the Microstructure and IMC Formation of Sn-Ag-Cu Solder on Cu and Ni (P) Substrates.   journal   = {International Journal of Chemical, Molecular, Nuclear, Materials and Metallurgical Engineering}, [online]. World Academy of Science, Engineering and Technology. December 2011, vol. 60(12). 1091 - 1095[viewed 18 March 2019]. Available from: