Open Science Research Excellence
Kornain, Z. , Jalar, A. , Rasid, R. , Seng, F. (2009). 'Effect of Curing Profile to Eliminate the Voids / Black Dots Formation in Underfill Epoxy for Hi-CTE Flip Chip Packaging'. World Academy of Science, Engineering and Technology, International Science Index 35, International Journal of Electrical, Computer, Energetic, Electronic and Communication Engineering, 3(11), 2162 - 2167.