Open Science Research Excellence
%0 Journal Article
%A Zainudin Kornain and  Azman Jalar and  Rozaidi Rasid and  Fong Chee Seng
%D 2009 
%J  International Journal of Electrical, Computer, Energetic, Electronic and Communication Engineering
%B World Academy of Science, Engineering and Technology
%I International Science Index 35, 2009
%T Effect of Curing Profile to Eliminate the Voids / Black Dots Formation in Underfill Epoxy for Hi-CTE Flip Chip Packaging
%V 35
%X Void formation in underfill is considered as failure
in flip chip manufacturing process. Void formation possibly caused
by several factors such as poor soldering and flux residue during
die attach process, void entrapment due moisture contamination,
dispense pattern process and setting up the curing process. This
paper presents the comparison of single step and two steps curing
profile towards the void and black dots formation in underfill for
Hi-CTE Flip Chip Ceramic Ball Grid Array Package (FC-CBGA).
Statistic analysis was conducted to analyze how different factors
such as wafer lot, sawing technique, underfill fillet height and
curing profile recipe were affected the formation of voids and
black dots. A C-Mode Scanning Aqoustic Microscopy (C-SAM)
was used to scan the total count of voids and black dots. It was
shown that the 2 steps curing profile provided solution for void
elimination and black dots in underfill after curing process.
%P 2162 - 2167