Scholarly Research Excellence
Satyanarayana and  K.N. Prabhu,  Study of Reactive Wetting of Sn–0.7Cu and Sn–0.3Ag–0.7Cu Lead Free Solders during Solidification on Nickel Coated Al Substrates.   journal   = {International Journal of Chemical, Molecular, Nuclear, Materials and Metallurgical Engineering}, [online]. World Academy of Science, Engineering and Technology. January 2013, vol. 73(1). 25 - 28[viewed 16 November 2018]. Available from: http://waset.org/publications/9580.