Open Science Research Excellence
Arijit Roy,  Instrumentation for Studying Real-time Popcorn Effect in Surface Mount Packages during Solder Reflow.   journal   = {International Journal of Electrical, Computer, Energetic, Electronic and Communication Engineering}, [online]. World Academy of Science, Engineering and Technology. August 2013, vol. 80(8). 1122 - 1126[viewed 21 May 2019]. Available from: http://waset.org/publications/9996639.