Scholarly Research Excellence

Digital Open Science Index

Commenced in January 2007 Frequency: Monthly Edition: International Paper Count: 3

3
9998350
Spark Plasma Sintering of Aluminum-Based Composites Reinforced by Nanocrystalline Carbon-Coated Intermetallic Particles
Abstract:

Aluminum Matrix Composites reinforced with nanocrystalline Ni3Al carbon-coated intermetallic particles, were synthesized by powder metallurgy. Powder mixture of aluminum with 0.5-volume fraction of reinforcement particles was compacted by spark plasma sintering (SPS) technique and the compared with conventional sintering process. The better results for SPS technique were obtained in 520ºC-5kN-3min.The hardness (70.5±8 HV) and the elastic modulus (95 GPa) were evaluated in function of sintering conditions for SPS technique; it was found that the incorporation of these kind of reinforcement particles in aluminum matrix improve its mechanical properties. The densities were about 94% and 97% of the theoretical density. The carbon coating avoided the interfacial reaction between matrix-particle at high temperature (520°C) without show composition change either intermetallic dissolution.

2
9580
Study of Reactive Wetting of Sn–0.7Cu and Sn–0.3Ag–0.7Cu Lead Free Solders during Solidification on Nickel Coated Al Substrates
Abstract:
Microstructure, wetting behavior and interfacial reactions between Sn–0.7Cu and Sn–0.3Ag–0.7Cu (SAC0307) solders solidified on Ni coated Al substrates were compared and investigated. Microstructure of Sn–0.7Cu alloy exhibited a eutectic matrix composed of primary β-Sn dendrites with a fine dispersion of Cu6Sn5 intermetallics whereas microstructure of SAC0307 alloy exhibited coarser Cu6Sn5 and finer Ag3Sn precipitates of IMCs with decreased tin dendrites. Contact angles ranging from 22° to 26° were obtained for Sn–0.7Cu solder solidified on substrate surface whereas for SAC0307 solder alloy contact angles were found to be in the range of 20° to 22°. Sn–0.7Cu solder/substrate interfacial region exhibited faceted (Cu, Ni)6Sn5 IMCs protruding into the solder matrix and a small amount of (Cu, Ni)3Sn4 intermetallics at the interface. SAC0307 solder/substrate interfacial region showed mainly (Cu, Ni)3Sn4 intermetallics adjacent to the coating layer and (Cu, Ni)6Sn5 IMCs in the solder matrix. The improvement in the wettability of SAC0307 solder alloy on substrate surface is attributed to the formation of cylindrical shape (Cu,Ni)6Sn5 and a layer of (Cu, Ni)3Sn4 IMCs at the interface.
1
2660
Fracture Location Characterizations of Dissimilar Friction Stir Welds
Abstract:
This paper reports the tensile fracture location characterizations of dissimilar friction stir welds between 5754 aluminium alloy and C11000 copper. The welds were produced using three shoulder diameter tools; namely, 15, 18 and 25 mm by varying the process parameters. The rotational speeds considered were 600, 950 and 1200 rpm while the feed rates employed were 50, 150 and 300 mm/min to represent the low, medium and high settings respectively. The tensile fracture locations were evaluated using the optical microscope to identify the fracture locations and were characterized. It was observed that 70% of the tensile samples failed in the Thermo Mechanically Affected Zone (TMAZ) of copper at the weld joints. Further evaluation of the fracture surfaces of the pulled tensile samples revealed that welds with low Ultimate Tensile Strength either have defects or intermetallics present at their joint interfaces.
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