|Commenced in January 2007||Frequency: Monthly||Edition: International||Paper Count: 8|
The temperature dependence of wettability (wetting angle, Θ (T)) for Ag-based melts on graphite and Al2O3 substrates is compared. Typical alloying effects are found, as the Ag host metal is gradually replaced by various metallic elements. The essence of alloying lies in the change of the electron/atom (e/a) ratio. This ratio is also manifested in the shift of wetting angles on the same substrate. Nevertheless, the effects are partially smeared by other (metallurgical) factors, like the interaction between the oxygenalloying elements and by the graphite substrate-oxygen interaction. In contrast, such effects are not pronounced in the case of Al2O3 substrates. As a consequence, Θ(T) exhibits an opposite trend in the case of two substrates. Crossovers of the Θ(T) curves were often found. The positions of crossovers depend on the chemical character and concentration of solute atoms. Segregation and epitaxial texture formation after solidification were also observed in certain alloy drops, especially in high concentration range. This phenomenon is not yet explained in every detail.
Occurrence of popcorn in IC packages while assembling them onto the PCB is a well known moisture sensitive reliability issues, especially for surface mount packages. Commonly reflow soldering simulation process is conducted to assess the impact of assembling IC package onto PCB. A strain gauge-based instrumentation is developed to investigate the popcorn effect in surface mount packages during reflow soldering process. The instrument is capable of providing real-time quantitative information of the occurrence popcorn phenomenon in IC packages. It is found that the popcorn occur temperatures between 218 to 241°C depending on moisture soak condition, but not at the peak temperature of the reflow process. The presence of popcorn and delamination are further confirmed by scanning acoustic tomography as a failure analysis.
Laser soldering is based on applying some soldering material (albumin) onto the approximated edges of the cut and heating the solder (and the underlying tissues) by a laser beam. Endogenous and exogenous materials such as indocyanine green (ICG) are often added to solders to enhance light absorption. Gold nanoshells are new materials which have an optical response dictated by the plasmon resonance. The wavelength at which the resonance occurs depends on the core and shell sizes, allowing nanoshells to be tailored for particular applications. The purposes of this study was use combination of ICG and different concentration of gold nanoshells for skin tissue soldering and also to examine the effect of laser soldering parameters on the properties of repaired skin. Two mixtures of albumin solder and different combinations of ICG and gold nanoshells were prepared. A full thickness incision of 2×20 mm2 was made on the surface and after addition of mixtures it was irradiated by an 810nm diode laser at different power densities. The changes of tensile strength σt due to temperature rise, number of scan (Ns), and scan velocity (Vs) were investigated. The results showed at constant laser power density (I), σt of repaired incisions increases by increasing the concentration of gold nanoshells in solder, Ns and decreasing Vs. It is therefore important to consider the tradeoff between the scan velocity and the surface temperature for achieving an optimum operating condition. In our case this corresponds to σt =1800 gr/cm2 at I~ 47 Wcm-2, T ~ 85ºC, Ns =10 and Vs=0.3mms-1.