Open Science Research Excellence

M R Baiju

Publications

2

Publications

2
9999857
A Floating Gate MOSFET Based Novel Programmable Current Reference
Abstract:

In this paper a scheme is proposed for generating a programmable current reference which can be implemented in the CMOS technology. The current can be varied over a wide range by changing an external voltage applied to one of the control gates of FGMOS (Floating Gate MOSFET). For a range of supply voltages and temperature, CMOS current reference is found to be dependent, this dependence is compensated by subtracting two current outputs with the same dependencies on the supply voltage and temperature. The system performance is found to improve with the use of FGMOS. Mathematical analysis of the proposed circuit is done to establish supply voltage and temperature independence. Simulation and performance evaluation of the proposed current reference circuit is done using TANNER EDA Tools. The current reference shows the supply and temperature dependencies of 520 ppm/V and 312 ppm/oC, respectively. The proposed current reference can operate down to 0.9 V supply.

Keywords:
Floating Gate MOSFET, current reference, self bias scheme, temperature independency, supply voltage independency.
1
10006819
Analysis of Thermal Damping in Si Based Torsional Micromirrors
Abstract:

The thermal damping of a dynamic vibrating micromirror is an important factor affecting the design of MEMS based actuator systems. In the development process of new micromirror systems, assessing the extent of energy loss due to thermal damping accurately and predicting the performance of the system is very essential. In this paper, the depth of the thermal penetration layer at different eigenfrequencies and the temperature variation distributions surrounding a vibrating micromirror is analyzed. The thermal penetration depth corresponds to the thermal boundary layer in which energy is lost which is a measure of the thermal damping is found out. The energy is mainly dissipated in the thermal boundary layer and thickness of the layer is an important parameter. The detailed thermoacoustics is used to model the air domain surrounding the micromirror. The thickness of the boundary layer, temperature variations and thermal power dissipation are analyzed for a Si based torsional mode micromirror. It is found that thermal penetration depth decreases with eigenfrequency and hence operating the micromirror at higher frequencies is essential for reducing thermal damping. The temperature variations and thermal power dissipations at different eigenfrequencies are also analyzed. Both frequency-response and eigenfrequency analyses are done using COMSOL Multiphysics software.

Keywords:
Eigen frequency analysis, micromirrors, thermal damping, thermoacoustic interactions.