Open Science Research Excellence

W K Choi

Publications

1

Publications

1
10008773
The Grinding Influence on the Strength of Fan-Out Wafer-Level Packages
Abstract:
To build a thin fan-out wafer-level package, the package had to be ground to a thin level. In this work, the influence of the grinding processes on the strength of the fan-out wafer-level packages was investigated. After different grinding processes, all specimens were placed on a three-point-bending fixture installed on a universal tester for three-point-bending testing, and the strength of the fan-out wafer-level packages was measured. The experiments revealed that the average flexure strength increased with the decreasing surface roughness height of the fan-out wafer-level package tested. The grinding processes had a significant influence on the strength of the fan-out wafer-level packages investigated.
Keywords:
FOWLP strength, surface roughness, three-point bending, grinding.