Scholarly Research Excellence

ICEPST 2017 : 19th International Conference on Electronic Packaging, Systems, and Technology

London, United Kingdom
October 19 - 20, 2017

Call for Papers

ICEPST 2017 : 19th International Conference on Electronic Packaging, Systems, and Technology is the premier interdisciplinary platform for the presentation of new advances and research results in the fields of Electronic Packaging, Systems, and Technology. The conference will bring together leading academic scientists, researchers and scholars in the domain of interest from around the world. Topics of interest for submission include, but are not limited to:
  • Advanced and emerging issues in electrical modeling, analysis, synthesis and design of electronic interconnections, packages and systems
  • Advanced and parallel CAD techniques for signal, power and thermal integrity analysis
  • Advanced Manufacturing Technologies and Packaging Equipment
  • Advanced Packaging and System Integration
  • Components, Packaging and Manufacturing Technology
  • Electrical performance of high-performance interconnect systems
  • Electromagnetic (EM) and EM interference modeling, simulation algorithms, tools and flows
  • Electronic packages and microsystems
  • Electronic Packaging, Systems, and Technology
  • Emerging and advanced issues
  • Emerging Technologies
  • High-speed channels, links, backplanes, serial and parallel interconnects, SerDes
  • Inter-connection technologies
  • Jitter and noise management
  • Low power mobile and personal applications
  • Macromodeling and model order reduction as it applies to electrical analysis
  • Measurement and data analysis techniques for system-level and on-chip structures
  • Memory and DDR interfaces
  • Microwave and Power electronics Packaging
  • Microwave Theory and Techniques
  • Multiconductor transmission lines
  • Nano interconnects and nano structures
  • New design techniques and innovative architectures
  • New methodologies and CAD/design techniques for evaluating and ensuring signal, power and thermal integrity in high-speed designs
  • Novel CAD concepts, methodologies and algorithms for modeling, simulation and optimization
  • Package-chip co-design
  • Packaging Design and Modeling
  • Packaging Materials and Processes
  • Power integrity and power distribution networks
  • Quality and Reliability
  • RF/microwave packaging structures, RFICs, mixed signal modules and wireless switches
  • Signal and thermal integrity
  • Solid State Lighting Packaging and Integration
  • System-level, board-level and on-chip interconnects
  • 3D interconnects, 3D packages, TSVs and MCMs