Excellence in Research and Innovation for Humanity

ICNSM 2019 : 21st International Conference on Nanostructured Semiconductor Materials

Paris, France
January 24 - 25, 2019

Conference Code: 19FR01ICNSM

Conference Proceedings

All submitted conference papers will be blind peer reviewed by three competent reviewers. The peer-reviewed conference proceedings are indexed in the International Science Index (ISI), Google Scholar, Semantic Scholar, Zenedo, OpenAIRE, BASE, WorldCAT, Sherpa/RoMEO, and other index databases. Impact Factor Indicators.

Special Journal Issues

ICNSM 2019 has teamed up with the Special Journal Issue on Nanostructured Semiconductor Materials. A number of selected high-impact full text papers will also be considered for the special journal issues. All submitted papers will have the opportunity to be considered for this Special Journal Issue. The paper selection will be carried out during the peer review process as well as at the conference presentation stage. Submitted papers must not be under consideration by any other journal or publication. The final decision for paper selection will be made based on peer review reports by the Guest Editors and the Editor-in-Chief jointly. Selected full-text papers will be published online free of charge.

Conference Sponsor and Exhibitor Opportunities

The Conference offers the opportunity to become a conference sponsor or exhibitor. To participate as a sponsor or exhibitor, please download and complete the Conference Sponsorship Request Form.

Important Dates

Abstracts/Full-Text Paper Submission Deadline   October 26, 2018
Notification of Acceptance/Rejection   November 9, 2018
Final Paper (Camera Ready) Submission & Early Bird Registration Deadline   December 24, 2018
Conference Dates   January 24 - 25, 2019

Important Notes

Please ensure your submission meets the conference's strict guidelines for accepting scholarly papers. Downloadable versions of the check list for Full-Text Papers and Abstract Papers.

Please refer to the Paper Submission GUIDE before submitting your paper.

Selected Conference Papers

1) Mechanical, Thermal and Biodegradable Properties of Bioplast-Spruce Green Wood Polymer Composites
A. Atli, K. Candelier, J. Alteyrac
2) Graft Copolymerization of Cellulose Acetate with Nitro-N-Amino Phenyl Maleimides
Azza. A. Al-Ghamdi, Abir. A. Abdel-Naby
3) An Inverse Heat Transfer Algorithm for Predicting the Thermal Properties of Tumors during Cryosurgery
Mohamed Hafid, Marcel Lacroix
4) Recovery of Metals from Electronic Waste by Physical and Chemical Recycling Processes
Muammer Kaya
5) UV-Cured Coatings Based on Acrylated Epoxidized Soybean Oil and Epoxy Carboxylate
Alaaddin Cerit, Suheyla Kocaman, Ulku Soydal
6) Influence of Iron Ore Mineralogy on Cluster Formation inside the Shaft Furnace
M. Bahgat, H. A. Hanafy, S. Lakdawala
7) A Note on Metallurgy at Khanak: An Indus Site in Tosham Mining Area, Haryana
Ravindra N. Singh, Dheerendra P. Singh
8) Investigation of Ceramic-Metal Composites Produced by Electroless Ni Plating of AlN- Astaloy Cr-M
A. Yönetken, A. Erol, A. Yakar, G. Peşmen
9) Dependence of Densification, Hardness and Wear Behaviors of Ti6Al4V Powders on Sintering Temperature
Adewale O. Adegbenjo, Elsie Nsiah-Baafi, Mxolisi B. Shongwe, Mercy Ramakokovhu, Peter A. Olubambi
10) Using Fly Ash as a Reinforcement to Increase Wear Resistance of Pure Magnesium
E. Karakulak, R. Yamanoğlu, M. Zeren
11) Application of Recycled Tungsten Carbide Powder for Fabrication of Iron Based Powder Metallurgy Alloy
Yukinori Taniguchi, Kazuyoshi Kurita, Kohei Mizuta, Keigo Nishitani, Ryuichi Fukuda
12) Metallurgy of Friction Welding of Porous Stainless Steel-Solid Iron Billets
S. D. El Wakil
13) Lithium Oxide Effect on the Thermal and Physical Properties of the Ternary System Glasses (Li2O3-B2O3-Al2O3)
D. Aboutaleb, B. Safi
14) The Effect of Geometrical Ratio and Nanoparticle Reinforcement on the Properties of Al-Based Nanocomposite Hollow Sphere Structures
M. Amirjan
15) Evaluation of Bakery Products Made from Barley-Gelatinized Corn Flour and Wheat-Defatted Rice Bran Flour Composites
Ahmed M. S. Hussein, Sahar Y. Al-Okbi

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