Open Science Research Excellence

ICAEEP 2020 : International Conference on Advances in Electronics and Electron Physics

Dubai, UAE
January 30 - 31, 2020

Conference Code: 20AE01ICAEEP

Conference Proceedings

All submitted conference papers will be blind peer reviewed by three competent reviewers. The peer-reviewed conference proceedings are indexed in the Open Science Index, Google Scholar, Semantic Scholar, Zenedo, OpenAIRE, BASE, WorldCAT, Sherpa/RoMEO, and other index databases. Impact Factor Indicators.

Special Journal Issues

ICAEEP 2020 has teamed up with the Special Journal Issue on Advances in Electronics and Electron Physics. A number of selected high-impact full text papers will also be considered for the special journal issues. All submitted papers will have the opportunity to be considered for this Special Journal Issue. The paper selection will be carried out during the peer review process as well as at the conference presentation stage. Submitted papers must not be under consideration by any other journal or publication. The final decision for paper selection will be made based on peer review reports by the Guest Editors and the Editor-in-Chief jointly. Selected full-text papers will be published online free of charge.

Conference Sponsor and Exhibitor Opportunities

The Conference offers the opportunity to become a conference sponsor or exhibitor. To participate as a sponsor or exhibitor, please download and complete the Conference Sponsorship Request Form.

Important Dates

Abstracts/Full-Text Paper Submission Deadline   August 29, 2019
Notification of Acceptance/Rejection   September 10, 2019
Final Paper (Camera Ready) Submission & Early Bird Registration Deadline   December 31, 2019
Conference Dates   January 30 - 31, 2020

Important Notes

Please ensure your submission meets the conference's strict guidelines for accepting scholarly papers. Downloadable versions of the check list for Full-Text Papers and Abstract Papers.

Please refer to the Paper Submission GUIDE before submitting your paper.

Selected Conference Papers

1) Fully Printed Strain Gauges: A Comparison of Aerosoljet-Printing and Micropipette-Dispensing
Benjamin Panreck, Manfred Hild
2) Fabrication of Wearable Antennas through Thermal Deposition
Jeff Letcher, Dennis Tierney, Haider Raad
3) A Compact Wearable Slot Antenna for LTE and WLAN Applications
Haider K. Raad
4) Generic Data Warehousing for Consumer Electronics Retail Industry
S. Habte, K. Ouazzane, P. Patel, S. Patel
5) The Development and Testing of a Small Scale Dry Electrostatic Precipitator for the Removal of Particulate Matter
Derek Wardle, Tarik Al-Shemmeri, Neil Packer
6) Microscopic Analysis of Interfacial Transition Zone of Cementitious Composites Prepared by Various Mixing Procedures
Josef Fládr, Jiří Němeček, Veronika Koudelková, Petr Bílý
7) Dynamic Modelling and Virtual Simulation of Digital Duty-Cycle Modulation Control Drivers
J. Mbihi
8) A Simple Chemical Precipitation Method of Titanium Dioxide Nanoparticles Using Polyvinyl Pyrrolidone as a Capping Agent and Their Characterization
V. P. Muhamed Shajudheen, K. Viswanathan, K. Anitha Rani, A. Uma Maheswari, S. Saravana Kumar
9) Localized and Time-Resolved Velocity Measurements of Pulsatile Flow in a Rectangular Channel
R. Blythman, N. Jeffers, T. Persoons, D. B. Murray
10) A Fault-Tolerant Full Adder in Double Pass CMOS Transistor
Abdelmonaem Ayachi, Belgacem Hamdi
11) Cellular Components of the Hemal Node of Egyptian Cattle
Amira E. Derbalah, Doaa M. Zaghloul
12) Mesoporous Material Nanofibers by Electrospinning
Sh. Sohrabnezhad, A. Jafarzadeh
13) Micropower Composite Nanomaterials Based on Porous Silicon for Renewable Energy Sources
Alexey P. Antropov, Alexander V. Ragutkin, Nicolay A. Yashtulov
14) A Novel Approach to Asynchronous State Machine Modeling on Multisim for Avoiding Function Hazards
L. Parisi, D. Hamili, N. Azlan
15) Morphological Interaction of Porcine Oocyte and Cumulus Cells Study on in vitro Oocyte Maturation Using Electron Microscopy
M. Areekijseree, W. Pongsawat, M. Pumipaiboon, C. Thepsithar, S. Sengsai, T. Chuen-Im

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