Conference Code: 20UK12ICMEB
International Research Conference Aims and Objectives
The
ICMEB 2020: 22nd International Conference on Molecular Electronics and Bioelectronics aims to bring together leading academic scientists, researchers and research scholars to exchange and share their experiences and research results on all aspects of Molecular Electronics and Bioelectronics. It also provides a premier interdisciplinary platform for researchers, practitioners and educators to present and discuss the most recent innovations, trends, and concerns as well as practical challenges encountered and solutions adopted in the fields of Molecular Electronics and Bioelectronics.
Call for Contributions
All honorable authors are kindly encouraged to contribute to and help shape the conference through submissions of their research abstracts, papers and e-posters. Also, high quality research contributions describing original and unpublished results of conceptual, constructive, empirical, experimental, or theoretical work in all areas of Molecular Electronics and Bioelectronics are cordially invited for presentation at the conference. The conference solicits contributions of abstracts, papers and e-posters that address themes and topics of the conference, including figures, tables and references of novel research materials.
WASET
Conference Proceedings
All submitted conference papers will be blind peer reviewed by three competent reviewers. The peer-reviewed conference proceedings are indexed in the
International Science Index (ISI),
Google Scholar,
Semantic Scholar,
Zenedo,
OpenAIRE,
BASE,
WorldCAT,
Sherpa/RoMEO, and other index databases.
Impact Factor Indicators.
Special Journal Issues
ICMEB 2020 has teamed up with the Special Journal Issue on
Molecular Electronics and Bioelectronics.
A number of selected high-impact full text papers will also be considered for the special journal issues. All submitted papers will have the opportunity to be considered for this Special Journal Issue. The paper selection will be carried out during the peer review process as well as at the conference presentation stage. Submitted papers must not be under consideration by any other journal or publication. The final decision for paper selection will be made based on peer review reports by the Guest Editors and the Editor-in-Chief jointly. Selected full-text papers will be published online free of charge.
Conference Sponsor and Exhibitor Opportunities
The Conference offers the opportunity to become a conference sponsor or exhibitor. To participate as a sponsor or exhibitor, please download and complete
the Conference Sponsorship Request Form.
Important Dates
Abstracts/Full-Text Paper Submission Deadline |
|
February 7, 2020 |
Notification of Acceptance/Rejection |
|
May 21, 2020 |
Final Paper (Camera Ready) Submission & Early Bird Registration Deadline |
|
August 21, 2020 |
Conference Dates |
|
December 7 - 8, 2020 |
Important Notes
Please ensure your submission meets the conference's strict guidelines for accepting scholarly papers. Downloadable versions of the check list for
Full-Text Papers and
Abstract Papers.
Please refer to the
Paper Submission GUIDE before submitting your paper.
Selected Conference Papers
1) Effect of Retained Austenite Stability in Corrosion Mechanism of Dual Phase High Carbon SteelW. Handoko, F. Pahlevani, V. Sahajwalla 2) Tensile Properties of 3D Printed PLA under Unidirectional and Bidirectional Raster Angle: A Comparative Study Shilpesh R. Rajpurohit, Harshit K. Dave 3) Impact of Process Parameters on Tensile Strength of Fused Deposition Modeling Printed Crisscross Poylactic Acid Shilpesh R. Rajpurohit, Harshit K. Dave 4) Simulation of Reflection Loss for Carbon and Nickel-Carbon Thin FilmsM. Emami, R. Tarighi, R. Goodarzi 5) Non-Circular Carbon Fiber Reinforced Polymers Chainring Failure AnalysisA. Elmikaty, Z. Thanawarothon, L. Mezeix 6) Temperature Dependent Interaction Energies among X (=Ru, Rh) Impurities in Pd-Rich PdX AlloysM. Asato, C. Liu, N. Fujima, T. Hoshino, Y. Chen, T. Mohri 7) Single-Walled Carbon Nanotube Synthesis by Chemical Vapor Deposition Using Platinum-Group Metal CatalystsT. Maruyama, T. Saida, S. Naritsuka, S. Iijima 8) Texture Observation of Bending by XRD and EBSD MethodTakashi Sakai, Yuri Shimomura 9) Investigation on Mesh Sensitivity of a Transient Model for Nozzle CloggingH. Barati, M. Wu, A. Kharicha, A. Ludwig 10) SEM-EBSD Observation for Microtubes by Using Dieless Drawing ProcessTakashi Sakai, Itaru Kumisawa 11) Numerical Modelling of Surface Waves Generated by Low Frequency Electromagnetic Field for Silicon Refinement ProcessV. Geza, J. Vencels, G. Zageris, S. Pavlovs 12) Time Temperature Dependence of Long Fiber Reinforced Polypropylene Manufactured by Direct Long Fiber Thermoplastic ProcessK. A. Weidenmann, M. Grigo, B. Brylka, P. Elsner, T. Böhlke 13) Preparation and Conductivity Measurements of LSM/YSZ Composite Solid Oxide Electrolysis Cell Anode MaterialsChristian C. Vaso, Rinlee Butch M. Cervera 14) Research of the Load Bearing Capacity of Inserts Embedded in CFRP under Different Loading ConditionsF. Pottmeyer, M. Weispfenning, K. A. Weidenmann 15) Development of Single Layer of WO3 on Large Spatial Resolution by Atomic Layer Deposition TechniqueS. Zhuiykov, Zh. Hai, H. Xu, C. Xue
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