Open Science Research Excellence

Open Science Index

Commenced in January 2007 Frequency: Monthly Edition: International Publications Count: 29847


Select areas to restrict search in scientific publication database:
10002301
Microstructure, Mechanical, Electrical and Thermal Properties of the Al-Si-Ni Ternary Alloy
Abstract:
In recent years, the use of the aluminum based alloys in the industry and technology are increasing. Alloying elements in aluminum have further been improving the strength and stiffness properties that provide superior compared to other metals. In this study, investigation of physical properties (microstructure, microhardness, tensile strength, electrical conductivity and thermal properties) in the Al-12.6wt.%Si-%2wt.Ni ternary alloy were investigated. Al-Si-Ni alloy was prepared in vacuum atmosphere. The samples were directionally solidified upwards with different growth rate V (8.3−165.45 μm/s) at constant temperature gradient G (7.73 K/mm). The flake spacings (λ), microhardness (HV), ultimate tensile strength (σ), electrical resistivity (ρ) and thermal properties (H, Cp, Tm) of the samples were measured. Influence of the growth rate and spacings on microhardness, ultimate tensile strength and electrical resistivity were investigated and relationships between them were obtained. According to results, λ values decrease with increasing V, but HV, σ and ρ values increase with increasing V. Variations of electrical resistivity (ρ) of solidified samples were also measured. The enthalpy of fusion (H) and specific heat (Cp) for the alloy was also determined by differential scanning calorimeter (DSC) from heating trace during the transformation from liquid to solid. The results in this work were compared with the previous similar experimental results.
Digital Object Identifier (DOI):

References:

[1] Fraś, E. (2003), Solidification of Metals. Warszawa: Wydawnictwo Naukowo-Techniczne.
[2] H. Junga, N. Mangelinck-Noëlb, N. Nguyen-Thib,B. Billiab, “Columnar to Equiaxed Transition During Directional Solidification in Refined Al- Based Alloys.” Journal of Alloys and Compunds, 484(1-2), 2009, pp. 739-746.
[3] D. Ruvalcaba, R. H. Mathiesen, D. G. Eskin, L. Arnberg, L.Katgerman, “In situ Observations of Dendritic Fragmentation Due to Local Solute- Enrichment During Directional Solidification of an Aluminum Alloy. ” Acta Materialia, 55(13), 2007, pp. 4287-4292.
[4] P. Mikołajczak, L. Ratke, “Directional Solidification of AlSi Alloys with Fe Intermetallic Phases,” Archıves of Foundry Engineering, 14(1), 2014, pp. 75-78.
[5] P. E. Tomaszewski, “Jan Czochralski - Father of the Czochralski method.” Journal of Crystal Growth, 236, 2002, pp. 1-4.
[6] T. Duffar, M. D. Serrano, C. D. Moore, J. Camassel, S. Contreras&B. K. Tanner, “Bridgman Solidification of GaSb in Space.” Journal of Crystal Growth. 192, 1998, pp. 63-72.
[7] E. R. Wang, X. D. Hui, S. S.Wang, Y. F. Zhao, G. L. Chen, “Improved Mechanical Properties in Cast Al-Si alloys by Combined Alloying of Fe and Cu.” Materials Science and Engineering A, 527, 2010, pp. 7878- 7884.
[8] A. M. Samuel, F. H. Samuel, H. W. Doty, “Observation on the Formation ß-Al5FeSi Phase in 319 Type Al-Si Alloys.” Journal of Materials Science, 31, 1996, pp. 5529-5539.
[9] L. Lu, A.K. Dahle, Mater. Sci. Eng. A, 435–436, 2006, pp. 288–296.
[10] H. Kaya, “Dependency of Electrical Resistivity on the Temperature and Composition of Al-Cu Alloys,” Materials Research Innovations, 16 (1), 2012, pp. 224-229,
[11] H. Kaya, E. Çadirli, A. Ülgen, "Investigation of the Effect of Composition on Micro-Hardness and Determination of Thermo-Physical Properties in the Zn-Cu Alloys", Materials& Design, 32, 2011, pp. 900- 906.
[12] R. Trivedi and W. Kurz, Int. Mat. Rev. 39, 1994, pp.49.
[13] M. I. Yilmazer, H. Kaya, A. Aker, S. Engin, "Influence of the Growth Rate on Physical Properties in the Aluminum-Antimony Eutectic Alloy", International Journal of Materials Engineering and Technology, 9, 2013, pp. 59-76.
[14] A. Aker, H. Kaya, “Measurements of Microstructural, Mechanical, Electrical and Thermal Properties of an Al-Ni Alloy”, International Journal of Thermo-Physics, 34 (1), 2013, pp. 267-283.
[15] M. Smiths, “Measurement of Sheet Resistivities with the Four-Point Probe.” (D). The Bell System Technology, 37, 1958, pp.711.
[16] H. Kaya, E. Çadırlı, U. Böyük U, et al. “Variation of Microindentation Hardness with Solidification and Microstructure Parameters in the Al Based Alloys.” (J). Applied Surface Science. 255(5), 2008, pp. 3071- 3078.
[17] S. Khan, A. Ourdjini, Q. S. Hamed, et al. Journal Material Science. 28, 1998, pp. 5957.
[18] U. Böyük, “Physical and Mechanical Properties of Al–Si–Ni Eutectic Alloy,” Metals and Materials International, 18, 2012, 6, pp. 933-938.
[19] H. Kaya, U. Böyük, E. Çadırlı et al. “Measurements of the Micro- Hardness, Electrical and Thermal Properties of the Al–Ni Eutectic Alloy,” Materials Design. 34, 2012, pp. 707-712.
[20] A. Sergeev, V. Mitin, “Electron-Phonon Interaction in Disordered Conductors: Static and Vibrating Scattering Potentials.” (J). Physical Review B., 61, 2000, pp. 6041-6047.
[21] Z. Boekelheide, D. W. Cooke, E. Helgren, et al. “Resonant Impurity Scattering and Electron-Phonon Scattering in the Electrical Resistivity of Cr Thin Films.” (J). Physical Review B, 2009, pp.80134426- 80134438.
Vol:13 No:07 2019Vol:13 No:06 2019Vol:13 No:05 2019Vol:13 No:04 2019Vol:13 No:03 2019Vol:13 No:02 2019Vol:13 No:01 2019
Vol:12 No:12 2018Vol:12 No:11 2018Vol:12 No:10 2018Vol:12 No:09 2018Vol:12 No:08 2018Vol:12 No:07 2018Vol:12 No:06 2018Vol:12 No:05 2018Vol:12 No:04 2018Vol:12 No:03 2018Vol:12 No:02 2018Vol:12 No:01 2018
Vol:11 No:12 2017Vol:11 No:11 2017Vol:11 No:10 2017Vol:11 No:09 2017Vol:11 No:08 2017Vol:11 No:07 2017Vol:11 No:06 2017Vol:11 No:05 2017Vol:11 No:04 2017Vol:11 No:03 2017Vol:11 No:02 2017Vol:11 No:01 2017
Vol:10 No:12 2016Vol:10 No:11 2016Vol:10 No:10 2016Vol:10 No:09 2016Vol:10 No:08 2016Vol:10 No:07 2016Vol:10 No:06 2016Vol:10 No:05 2016Vol:10 No:04 2016Vol:10 No:03 2016Vol:10 No:02 2016Vol:10 No:01 2016
Vol:9 No:12 2015Vol:9 No:11 2015Vol:9 No:10 2015Vol:9 No:09 2015Vol:9 No:08 2015Vol:9 No:07 2015Vol:9 No:06 2015Vol:9 No:05 2015Vol:9 No:04 2015Vol:9 No:03 2015Vol:9 No:02 2015Vol:9 No:01 2015
Vol:8 No:12 2014Vol:8 No:11 2014Vol:8 No:10 2014Vol:8 No:09 2014Vol:8 No:08 2014Vol:8 No:07 2014Vol:8 No:06 2014Vol:8 No:05 2014Vol:8 No:04 2014Vol:8 No:03 2014Vol:8 No:02 2014Vol:8 No:01 2014
Vol:7 No:12 2013Vol:7 No:11 2013Vol:7 No:10 2013Vol:7 No:09 2013Vol:7 No:08 2013Vol:7 No:07 2013Vol:7 No:06 2013Vol:7 No:05 2013Vol:7 No:04 2013Vol:7 No:03 2013Vol:7 No:02 2013Vol:7 No:01 2013
Vol:6 No:12 2012Vol:6 No:11 2012Vol:6 No:10 2012Vol:6 No:09 2012Vol:6 No:08 2012Vol:6 No:07 2012Vol:6 No:06 2012Vol:6 No:05 2012Vol:6 No:04 2012Vol:6 No:03 2012Vol:6 No:02 2012Vol:6 No:01 2012
Vol:5 No:12 2011Vol:5 No:11 2011Vol:5 No:10 2011Vol:5 No:09 2011Vol:5 No:08 2011Vol:5 No:07 2011Vol:5 No:06 2011Vol:5 No:05 2011Vol:5 No:04 2011Vol:5 No:03 2011Vol:5 No:02 2011Vol:5 No:01 2011
Vol:4 No:12 2010Vol:4 No:11 2010Vol:4 No:10 2010Vol:4 No:09 2010Vol:4 No:08 2010Vol:4 No:07 2010Vol:4 No:06 2010Vol:4 No:05 2010Vol:4 No:04 2010Vol:4 No:03 2010Vol:4 No:02 2010Vol:4 No:01 2010
Vol:3 No:12 2009Vol:3 No:11 2009Vol:3 No:10 2009Vol:3 No:09 2009Vol:3 No:08 2009Vol:3 No:07 2009Vol:3 No:06 2009Vol:3 No:05 2009Vol:3 No:04 2009Vol:3 No:03 2009Vol:3 No:02 2009Vol:3 No:01 2009
Vol:2 No:12 2008Vol:2 No:11 2008Vol:2 No:10 2008Vol:2 No:09 2008Vol:2 No:08 2008Vol:2 No:07 2008Vol:2 No:06 2008Vol:2 No:05 2008Vol:2 No:04 2008Vol:2 No:03 2008Vol:2 No:02 2008Vol:2 No:01 2008
Vol:1 No:12 2007Vol:1 No:11 2007Vol:1 No:10 2007Vol:1 No:09 2007Vol:1 No:08 2007Vol:1 No:07 2007Vol:1 No:06 2007Vol:1 No:05 2007Vol:1 No:04 2007Vol:1 No:03 2007Vol:1 No:02 2007Vol:1 No:01 2007