International Conference on Adhesives for Electronic Applications

Adhesives for Electronic Applications Conference aims to bring together leading academic scientists, researchers and research scholars to exchange and share their experiences and research results on all aspects of Adhesives for Electronic Applications Conference. It also provides a premier interdisciplinary platform for researchers, practitioners, and educators to present and discuss the most recent innovations, trends, and concerns as well as practical challenges encountered and solutions adopted in the fields of Adhesives for Electronic Applications Conference.

Upcoming Conferences

DIGITAL
Rome
June 2022 in Rome
  • Conference Code: 22IT06ICAEE047
  • Abstract/Full-Text Paper Submission: May 05, 2022
  • Notification of Acceptance/Rejection: May 17, 2022
  • Final Paper and Early Bird Registration: May 02, 2022
  • Conference Date: June 02-03, 2022
Rome
May 2023 in Rome
  • Conference Code: 23IT05ICAEE047
  • Abstract/Full-Text Paper Submission: June 01, 2022
  • Notification of Acceptance/Rejection: June 15, 2022
  • Final Paper and Early Bird Registration: April 02, 2023
  • Conference Date: May 03-04, 2023
Rome
June 2023 in Rome
  • Conference Code: 23IT06ICAEE047
  • Abstract/Full-Text Paper Submission: June 01, 2022
  • Notification of Acceptance/Rejection: June 15, 2022
  • Final Paper and Early Bird Registration: May 02, 2023
  • Conference Date: June 03-04, 2023
Rome
May 2024 in Rome
  • Conference Code: 24IT05ICAEE047
  • Abstract/Full-Text Paper Submission: August 01, 2023
  • Notification of Acceptance/Rejection: September 04, 2023
  • Final Paper and Early Bird Registration: April 02, 2024
  • Conference Date: May 03-04, 2024
Rome
June 2024 in Rome
  • Conference Code: 24IT06ICAEE047
  • Abstract/Full-Text Paper Submission: August 01, 2023
  • Notification of Acceptance/Rejection: September 04, 2023
  • Final Paper and Early Bird Registration: May 02, 2024
  • Conference Date: June 03-04, 2024