International Conference on Adhesives in Electronic Applications

Adhesives in Electronic Applications Conference aims to bring together leading academic scientists, researchers and research scholars to exchange and share their experiences and research results on all aspects of Adhesives in Electronic Applications Conference. It also provides a premier interdisciplinary platform for researchers, practitioners, and educators to present and discuss the most recent innovations, trends, and concerns as well as practical challenges encountered and solutions adopted in the fields of Adhesives in Electronic Applications Conference.

Upcoming Conferences

Amsterdam
January 2023 in Amsterdam
  • Conference Code: 23NL01ICAEA041
  • Abstract/Full-Text Paper Submission: June 01, 2022
  • Notification of Acceptance/Rejection: June 15, 2022
  • Final Paper and Early Bird Registration: December 15, 2022
  • Conference Date: January 21-22, 2023
Barcelona
March 2023 in Barcelona
  • Conference Code: 23ES03ICAEA041
  • Abstract/Full-Text Paper Submission: June 01, 2022
  • Notification of Acceptance/Rejection: June 15, 2022
  • Final Paper and Early Bird Registration: February 10, 2023
  • Conference Date: March 04-05, 2023
Amsterdam
January 2024 in Amsterdam
  • Conference Code: 24NL01ICAEA041
  • Abstract/Full-Text Paper Submission: August 01, 2023
  • Notification of Acceptance/Rejection: September 04, 2023
  • Final Paper and Early Bird Registration: December 15, 2023
  • Conference Date: January 21-22, 2024
Barcelona
March 2024 in Barcelona
  • Conference Code: 24ES03ICAEA041
  • Abstract/Full-Text Paper Submission: August 01, 2023
  • Notification of Acceptance/Rejection: September 04, 2023
  • Final Paper and Early Bird Registration: February 10, 2024
  • Conference Date: March 04-05, 2024