International Conference on Adhesives in Electronic Applications
Adhesives in Electronic Applications Conference aims to bring together leading academic scientists, researchers and research scholars to exchange and share their
experiences and research results on all aspects of Adhesives in Electronic Applications Conference.
It also provides a premier interdisciplinary platform for researchers, practitioners, and educators to present and discuss the most recent innovations,
trends, and concerns as well as practical challenges encountered and solutions adopted in the fields of Adhesives in Electronic Applications Conference.
Upcoming Events
March 2021 in Barcelona
- Event Code: 21ES03ICAEA
- Abstract/Full-Text Paper Submission: January 28, 2021
- Notification of Acceptance/Rejection: February 11, 2021
- Final Paper and Early Bird Registration: February 10, 2021
- Conference Date: March 04-05, 2021
January 2022 in Amsterdam
- Event Code: 22NL01ICAEA
- Abstract/Full-Text Paper Submission: March 01, 2021
- Notification of Acceptance/Rejection: March 15, 2021
- Final Paper and Early Bird Registration: December 15, 2021
- Conference Date: January 21-22, 2022
March 2022 in Barcelona
- Event Code: 22ES03ICAEA
- Abstract/Full-Text Paper Submission: March 01, 2021
- Notification of Acceptance/Rejection: March 15, 2021
- Final Paper and Early Bird Registration: February 10, 2022
- Conference Date: March 04-05, 2022
January 2023 in Amsterdam
- Event Code: 23NL01ICAEA
- Abstract/Full-Text Paper Submission: February 13, 2022
- Notification of Acceptance/Rejection: February 27, 2022
- Final Paper and Early Bird Registration: December 15, 2022
- Conference Date: January 21-22, 2023
March 2023 in Barcelona
- Event Code: 23ES03ICAEA
- Abstract/Full-Text Paper Submission: February 13, 2022
- Notification of Acceptance/Rejection: February 27, 2022
- Final Paper and Early Bird Registration: February 10, 2023
- Conference Date: March 04-05, 2023