International Conference on Advanced Adhesives in Electronic Packaging

Advanced Adhesives in Electronic Packaging Conference aims to bring together leading academic scientists, researchers and research scholars to exchange and share their experiences and research results on all aspects of Advanced Adhesives in Electronic Packaging Conference. It also provides a premier interdisciplinary platform for researchers, practitioners, and educators to present and discuss the most recent innovations, trends, and concerns as well as practical challenges encountered and solutions adopted in the fields of Advanced Adhesives in Electronic Packaging Conference.

Upcoming Events

Paris
September 2020 in Paris
  • Event Code: 20FR09ICAAEP
  • Abstract/Full-Text Paper Submission: December 12, 2019
  • Notification of Acceptance/Rejection: December 31, 2019
  • Final Paper and Early Bird Registration: August 19, 2020
  • Conference Date: September 17-18, 2020
Paris
September 2021 in Paris
  • Event Code: 21FR09ICAAEP
  • Abstract/Full-Text Paper Submission: December 12, 2019
  • Notification of Acceptance/Rejection: December 31, 2019
  • Final Paper and Early Bird Registration: August 19, 2021
  • Conference Date: September 20-21, 2021