ICAMP 2022: 16. International Conference on Advanced Materials Processing

July 19-20, 2022 in Helsinki, Finland

DIGITAL
Helsinki

Other Conferences

New York
January 2023 in New York
  • Conference Code: 23US01ICAMP035
  • Abstract/Full-Text Paper Submission: June 30, 2022
  • Notification of Acceptance/Rejection: July 14, 2022
  • Final Paper and Early Bird Registration: December 26, 2022
  • Conference Date: January 28-29, 2023
Helsinki
July 2023 in Helsinki
  • Conference Code: 23FI07ICAMP035
  • Abstract/Full-Text Paper Submission: June 30, 2022
  • Notification of Acceptance/Rejection: July 14, 2022
  • Final Paper and Early Bird Registration: June 18, 2023
  • Conference Date: July 19-20, 2023
New York
January 2024 in New York
  • Conference Code: 24US01ICAMP035
  • Abstract/Full-Text Paper Submission: August 01, 2023
  • Notification of Acceptance/Rejection: September 04, 2023
  • Final Paper and Early Bird Registration: December 26, 2023
  • Conference Date: January 28-29, 2024
Helsinki
July 2024 in Helsinki
  • Conference Code: 24FI07ICAMP035
  • Abstract/Full-Text Paper Submission: August 01, 2023
  • Notification of Acceptance/Rejection: September 04, 2023
  • Final Paper and Early Bird Registration: June 18, 2024
  • Conference Date: July 19-20, 2024