Open Science Research Excellence

ICEMET 2020 : International Conference on Electronics Manufacturing Engineering and Technology

Tokyo, Japan
January 6 - 7, 2020

Conference Code: 20JP01ICEMET

Conference Proceedings

All submitted conference papers will be blind peer reviewed by three competent reviewers. The peer-reviewed conference proceedings are indexed in the Open Science Index, Google Scholar, Semantic Scholar, Zenedo, OpenAIRE, BASE, WorldCAT, Sherpa/RoMEO, and other index databases. Impact Factor Indicators.

Special Journal Issues

ICEMET 2020 has teamed up with the Special Journal Issue on Electronics Manufacturing Engineering and Technology. A number of selected high-impact full text papers will also be considered for the special journal issues. All submitted papers will have the opportunity to be considered for this Special Journal Issue. The paper selection will be carried out during the peer review process as well as at the conference presentation stage. Submitted papers must not be under consideration by any other journal or publication. The final decision for paper selection will be made based on peer review reports by the Guest Editors and the Editor-in-Chief jointly. Selected full-text papers will be published online free of charge.

Conference Sponsor and Exhibitor Opportunities

The Conference offers the opportunity to become a conference sponsor or exhibitor. To participate as a sponsor or exhibitor, please download and complete the Conference Sponsorship Request Form.

Important Dates

Abstracts/Full-Text Paper Submission Deadline   August 29, 2019
Notification of Acceptance/Rejection   September 10, 2019
Final Paper (Camera Ready) Submission & Early Bird Registration Deadline   November 30, 2019
Conference Dates   January 6 - 7, 2020

Important Notes

Please ensure your submission meets the conference's strict guidelines for accepting scholarly papers. Downloadable versions of the check list for Full-Text Papers and Abstract Papers.

Please refer to the Paper Submission GUIDE before submitting your paper.

Selected Conference Papers

1) Reliability of Dissimilar Metal Soldered Joint in Fabrication of Electromagnetic Interference Shielded Door Frame
Rehan Waheed, Hasan Aftab Saeed, Wasim Tarar, Khalid Mahmood, Sajid Ullah Butt
2) Effectiveness of Lean Manufacturing Technologies on Improving Business Performance: A Study of Indian Manufacturing Industries
Saumyaranjan Sahoo, Sudhir Yadav
3) Perception of TQM Implementation and Perceived Cost of Poor Quality: A Case Study of Local Automotive Company’s Supplier
Fakhruddin Esa, Yusri Yusof
4) Critical Factors Affecting the Implementation of Total Quality Management in the Construction Industry in U.A.E
Firas Mohamad Al-Sabek
5) Wetting Properties of Silver Based Alloys
Zoltán Weltsch, József Hlinka, Eszter Kókai
6) Prioritising the TQM Enablers and IT Resources in the ICT Industry: An AHP Approach
Suby Khanam, Jamshed Siddiqui, Faisal Talib
7) Development of Performance Measures for the Implementation of Total Quality Management in Indian Industry
Perminderjit Singh, Sukhvir Singh
8) Sliding Mode Control of Autonomous Underwater Vehicles
Ahmad Forouzan Tabar, Mohammad Azadi, Alireza Alesaadi
9) Study Relationship between TQM on Empowerment and Job Satisfaction
Maziyar Nouraee
10) The Influence of Pad Thermal Diffusivity over Heat Transfer into the PCBs Structure
Mihai Brânzei, Ioan Plotog, Ion Pencea
11) Green Lean TQM Human Resource Management Practices in Malaysian Automotive Companies
Noor Azlina Mohd Salleh, Salmiah Kasolang, Ahmed Jaffar
12) Green Lean TQM Practices in Malaysian Automotive Companies
Noor Azlina Mohd Salleh, Salmiah Kasolang, Ahmed Jaffar
13) Lean TQM Automotive Factory Model System
Noor Azlina Mohd Salleh, Salmiah Kasolang, Ahmed Jaffar
14) Preliminary Results of In-Vitro Skin Tissue Soldering using Gold Nanoshells and ICG Combination
M. S. Nourbakhsh, M. E. Khosroshahi
15) Thermo-Mechanical Characterization of Skin Laser Soldering using Au Coated SiO2 Nanoshells
M.S.Nourbakhsh, M.E.khosroshahi

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