International Conference on Edible Food Packaging Industry and Applications

Edible Food Packaging Industry and Applications Conference aims to bring together leading academic scientists, researchers and research scholars to exchange and share their experiences and research results on all aspects of Edible Food Packaging Industry and Applications Conference. It also provides a premier interdisciplinary platform for researchers, practitioners, and educators to present and discuss the most recent innovations, trends, and concerns as well as practical challenges encountered and solutions adopted in the fields of Edible Food Packaging Industry and Applications Conference.

Upcoming Events

Barcelona
May 2021 in Barcelona
  • Event Code: 21ES05ICEFPIA
  • Abstract/Full-Text Paper Submission: March 01, 2021
  • Notification of Acceptance/Rejection: March 15, 2021
  • Final Paper and Early Bird Registration: April 23, 2021
  • Conference Date: May 24-25, 2021
London
February 2022 in London
  • Event Code: 22UK02ICEFPIA
  • Abstract/Full-Text Paper Submission: March 01, 2021
  • Notification of Acceptance/Rejection: March 15, 2021
  • Final Paper and Early Bird Registration: January 14, 2022
  • Conference Date: February 15-16, 2022
Barcelona
May 2022 in Barcelona
  • Event Code: 22ES05ICEFPIA
  • Abstract/Full-Text Paper Submission: March 01, 2021
  • Notification of Acceptance/Rejection: March 15, 2021
  • Final Paper and Early Bird Registration: April 23, 2022
  • Conference Date: May 24-25, 2022
London
February 2023 in London
  • Event Code: 23UK02ICEFPIA
  • Abstract/Full-Text Paper Submission: February 13, 2022
  • Notification of Acceptance/Rejection: February 27, 2022
  • Final Paper and Early Bird Registration: January 14, 2023
  • Conference Date: February 15-16, 2023
Barcelona
May 2023 in Barcelona
  • Event Code: 23ES05ICEFPIA
  • Abstract/Full-Text Paper Submission: February 13, 2022
  • Notification of Acceptance/Rejection: February 27, 2022
  • Final Paper and Early Bird Registration: April 23, 2023
  • Conference Date: May 24-25, 2023