International Conference on Electronic Coating and Packaging

Electronic Coating and Packaging Conference aims to bring together leading academic scientists, researchers and research scholars to exchange and share their experiences and research results on all aspects of Electronic Coating and Packaging Conference. It also provides a premier interdisciplinary platform for researchers, practitioners, and educators to present and discuss the most recent innovations, trends, and concerns as well as practical challenges encountered and solutions adopted in the fields of Electronic Coating and Packaging Conference.

Upcoming Conferences

DIGITAL
Bali
October 2022 in Bali
  • Conference Code: 22ID10ICECP014
  • Abstract/Full-Text Paper Submission: May 17, 2022
  • Notification of Acceptance/Rejection: May 31, 2022
  • Final Paper and Early Bird Registration: September 24, 2022
  • Conference Date: October 20-21, 2022
Paris
April 2023 in Paris
  • Conference Code: 23FR04ICECP014
  • Abstract/Full-Text Paper Submission: July 01, 2022
  • Notification of Acceptance/Rejection: August 01, 2022
  • Final Paper and Early Bird Registration: March 18, 2023
  • Conference Date: April 19-20, 2023
Bali
October 2023 in Bali
  • Conference Code: 23ID10ICECP014
  • Abstract/Full-Text Paper Submission: July 01, 2022
  • Notification of Acceptance/Rejection: August 01, 2022
  • Final Paper and Early Bird Registration: September 24, 2023
  • Conference Date: October 25-26, 2023
Paris
April 2024 in Paris
  • Conference Code: 24FR04ICECP014
  • Abstract/Full-Text Paper Submission: August 01, 2023
  • Notification of Acceptance/Rejection: September 04, 2023
  • Final Paper and Early Bird Registration: March 18, 2024
  • Conference Date: April 19-20, 2024
Bali
October 2024 in Bali
  • Conference Code: 24ID10ICECP014
  • Abstract/Full-Text Paper Submission: August 01, 2023
  • Notification of Acceptance/Rejection: September 04, 2023
  • Final Paper and Early Bird Registration: September 24, 2024
  • Conference Date: October 25-26, 2024