International Conference on Electronic Encapsulation Technologies and Applications

Electronic Encapsulation Technologies and Applications Conference aims to bring together leading academic scientists, researchers and research scholars to exchange and share their experiences and research results on all aspects of Electronic Encapsulation Technologies and Applications Conference. It also provides a premier interdisciplinary platform for researchers, practitioners, and educators to present and discuss the most recent innovations, trends, and concerns as well as practical challenges encountered and solutions adopted in the fields of Electronic Encapsulation Technologies and Applications Conference.

Upcoming Conferences

Paris
April 2024 in Paris
  • Conference Code: 24FRPA04ICEETA006
  • Abstract/Full-Text Paper Submission: October 03, 2023
  • Notification of Acceptance/Rejection: October 17, 2023
  • Final Paper and Early Bird Registration: March 18, 2024
  • Conference Date: April 19-20, 2024
Ottawa
July 2024 in Ottawa
  • Conference Code: 24CAOT07ICEETA006
  • Abstract/Full-Text Paper Submission: October 03, 2023
  • Notification of Acceptance/Rejection: October 17, 2023
  • Final Paper and Early Bird Registration: June 11, 2024
  • Conference Date: July 12-13, 2024
Paris
April 2025 in Paris
  • Conference Code: 25FRPA04ICEETA006
  • Abstract/Full-Text Paper Submission: October 03, 2023
  • Notification of Acceptance/Rejection: October 17, 2023
  • Final Paper and Early Bird Registration: March 18, 2025
  • Conference Date: April 19-20, 2025
Ottawa
July 2025 in Ottawa
  • Conference Code: 25CAOT07ICEETA006
  • Abstract/Full-Text Paper Submission: October 03, 2023
  • Notification of Acceptance/Rejection: October 17, 2023
  • Final Paper and Early Bird Registration: June 11, 2025
  • Conference Date: July 12-13, 2025