International Conference on Electronic Packaging and Adhesives in Electronics

Electronic Packaging and Adhesives in Electronics Conference aims to bring together leading academic scientists, researchers and research scholars to exchange and share their experiences and research results on all aspects of Electronic Packaging and Adhesives in Electronics Conference. It also provides a premier interdisciplinary platform for researchers, practitioners, and educators to present and discuss the most recent innovations, trends, and concerns as well as practical challenges encountered and solutions adopted in the fields of Electronic Packaging and Adhesives in Electronics Conference.