International Conference on Electronic Packaging and Adhesives in Electronics
Electronic Packaging and Adhesives in Electronics Conference aims to bring together leading academic scientists, researchers and research scholars to exchange and share their
experiences and research results on all aspects of Electronic Packaging and Adhesives in Electronics Conference.
It also provides a premier interdisciplinary platform for researchers, practitioners, and educators to present and discuss the most recent innovations,
trends, and concerns as well as practical challenges encountered and solutions adopted in the fields of Electronic Packaging and Adhesives in Electronics Conference.
Upcoming Conferences
DIGITAL

August 2022 in Montreal
- Conference Code: 22CA08ICEPAE002
- Abstract/Full-Text Paper Submission: June 01, 2022
- Notification of Acceptance/Rejection: June 15, 2022
- Final Paper and Early Bird Registration: July 05, 2022
- Conference Date: August 08-09, 2022

April 2023 in Paris
- Conference Code: 23FR04ICEPAE002
- Abstract/Full-Text Paper Submission: June 01, 2022
- Notification of Acceptance/Rejection: June 15, 2022
- Final Paper and Early Bird Registration: March 18, 2023
- Conference Date: April 19-20, 2023

August 2023 in Montreal
- Conference Code: 23CA08ICEPAE002
- Abstract/Full-Text Paper Submission: July 01, 2022
- Notification of Acceptance/Rejection: August 01, 2022
- Final Paper and Early Bird Registration: July 05, 2023
- Conference Date: August 05-06, 2023

April 2024 in Paris
- Conference Code: 24FR04ICEPAE002
- Abstract/Full-Text Paper Submission: August 01, 2023
- Notification of Acceptance/Rejection: September 04, 2023
- Final Paper and Early Bird Registration: March 18, 2024
- Conference Date: April 19-20, 2024

August 2024 in Montreal
- Conference Code: 24CA08ICEPAE002
- Abstract/Full-Text Paper Submission: August 01, 2023
- Notification of Acceptance/Rejection: September 04, 2023
- Final Paper and Early Bird Registration: July 05, 2024
- Conference Date: August 05-06, 2024