International Conference on Electronics Engineering and Adhesive Technologies

Electronics Engineering and Adhesive Technologies Conference aims to bring together leading academic scientists, researchers and research scholars to exchange and share their experiences and research results on all aspects of Electronics Engineering and Adhesive Technologies Conference. It also provides a premier interdisciplinary platform for researchers, practitioners, and educators to present and discuss the most recent innovations, trends, and concerns as well as practical challenges encountered and solutions adopted in the fields of Electronics Engineering and Adhesive Technologies Conference.

Upcoming Events

London
October 2020 in London
  • Event Code: 20UK10ICEEAT
  • Abstract/Full-Text Paper Submission: November 28, 2019
  • Notification of Acceptance/Rejection: December 17, 2019
  • Final Paper and Early Bird Registration: September 22, 2020
  • Conference Date: October 22-23, 2020
London
October 2021 in London
  • Event Code: 21UK10ICEEAT
  • Abstract/Full-Text Paper Submission: November 28, 2019
  • Notification of Acceptance/Rejection: December 17, 2019
  • Final Paper and Early Bird Registration: June 23, 2021
  • Conference Date: October 21-22, 2021