The International Research Conference Aims and Objectives
The International Research Conference is a federated organization dedicated to bringing together a significant number of diverse scholarly events for presentation
within the conference program. Events will run over a span of time during the conference depending on the number and length of the presentations.
With its high quality, it provides an exceptional value for students, academics and industry researchers.
ICEMETA 2022: 16. International Conference on Electronics Manufacturing Engineering, Technologies and Applications
aims to bring together leading academic scientists, researchers and research scholars to exchange and share their experiences and research results on all aspects of
Electronics Manufacturing Engineering, Technologies and Applications.
It also provides a premier interdisciplinary platform for researchers, practitioners and educators to present and discuss the most recent innovations,
trends, and concerns as well as practical challenges encountered and solutions adopted in the fields of Electronics Manufacturing Engineering, Technologies and Applications
Call for Contributions
Prospective authors are kindly encouraged to contribute to and help shape the conference through submissions of their research abstracts, papers and e-posters.
Also, high quality research contributions describing original and unpublished results of conceptual, constructive, empirical, experimental, or
theoretical work in all areas of Electronics Manufacturing Engineering, Technologies and Applications are cordially invited for presentation at the conference.
The conference solicits contributions of abstracts, papers and e-posters that address themes and topics of the conference, including figures, tables and references of
novel research materials.
Guidelines for Authors
Please ensure your submission meets the conference's strict guidelines for accepting scholarly papers.
Downloadable versions of the check list for
Full-Text Papers and
Abstract Papers.
Please refer to the
Paper Submission Guideline,
Abstract Submission Guideline and
Author Information
before submitting your paper.
Conference Proceedings
All submitted conference papers will be blind peer reviewed by three competent reviewers.
The peer-reviewed conference proceedings are indexed in the Open Science Index,
Google Scholar,
Semantic Scholar,
Zenedo,
OpenAIRE,
BASE,
WorldCAT,
Sherpa/RoMEO,
and other index databases. Impact Factor Indicators.
Special Journal Issues
ICEMETA 2022 has teamed up with the Special Journal Issue on
Electronics Manufacturing Engineering, Technologies and Applications.
A number of selected high-impact full text papers will also be considered for the special journal issues.
All submitted papers will have the opportunity to be considered for this Special Journal Issue.
The paper selection will be carried out during the peer review process as well as at the conference presentation stage.
Submitted papers must not be under consideration by any other journal or publication.
The final decision for paper selection will be made based on peer review reports by the Guest Editors and the Editor-in-Chief jointly.
Selected full-text papers will be published online free of charge.
Conference Sponsor and Exhibitor Opportunities
The Conference offers the opportunity to become a conference sponsor or exhibitor.
To participate as a sponsor or exhibitor, please download and complete the
Conference Sponsorship Request Form.
Selected Papers
-
Reliability of Dissimilar Metal Soldered Joint in Fabrication of Electromagnetic Interference Shielded Door Frame
Rehan Waheed, Hasan Aftab Saeed, Wasim Tarar, Khalid Mahmood, Sajid Ullah Butt
-
Effectiveness of Lean Manufacturing Technologies on Improving Business Performance: A Study of Indian Manufacturing Industries
Saumyaranjan Sahoo, Sudhir Yadav
-
Perception of TQM Implementation and Perceived Cost of Poor Quality: A Case Study of Local Automotive Company’s Supplier
Fakhruddin Esa, Yusri Yusof
-
Critical Factors Affecting the Implementation of Total Quality Management in the Construction Industry in U.A.E
Firas Mohamad Al-Sabek
-
Wetting Properties of Silver Based Alloys
Zoltán Weltsch, József Hlinka, Eszter Kókai
-
Prioritising the TQM Enablers and IT Resources in the ICT Industry: An AHP Approach
Suby Khanam, Jamshed Siddiqui, Faisal Talib
-
Development of Performance Measures for the Implementation of Total Quality Management in Indian Industry
Perminderjit Singh, Sukhvir Singh
-
Sliding Mode Control of Autonomous Underwater Vehicles
Ahmad Forouzan Tabar, Mohammad Azadi, Alireza Alesaadi
-
Study Relationship between TQM on Empowerment and Job Satisfaction
Maziyar Nouraee
-
The Influence of Pad Thermal Diffusivity over Heat Transfer into the PCBs Structure
Mihai Brânzei, Ioan Plotog, Ion Pencea
-
Green Lean TQM Human Resource Management Practices in Malaysian Automotive Companies
Noor Azlina Mohd Salleh, Salmiah Kasolang, Ahmed Jaffar
-
Green Lean TQM Practices in Malaysian Automotive Companies
Noor Azlina Mohd Salleh, Salmiah Kasolang, Ahmed Jaffar
-
Lean TQM Automotive Factory Model System
Noor Azlina Mohd Salleh, Salmiah Kasolang, Ahmed Jaffar
-
Preliminary Results of In-Vitro Skin Tissue Soldering using Gold Nanoshells and ICG Combination
M. S. Nourbakhsh, M. E. Khosroshahi
-
Thermo-Mechanical Characterization of Skin Laser Soldering using Au Coated SiO2 Nanoshells
M.S.Nourbakhsh, M.E.khosroshahi
Electronics manufacturing engineering
Manufacturing engineering
Supervising and improving productivity
Manufacturing engineering methods
Manufacturing standards
Standard manufacturing processes
Soldering
Mechanical assembly
Total quality management
Reference designations for electrical and electronics parts and equipment
Chemical bonding and coating of electronic equipment
Rework and repair
Electrical considerations in the design of a static-safe work environment
Mechanical design for surface mount assemblies
Preferred materials for electronic packaging
Occupational safety and health programs
Abstracts/Full-Text Paper Submission Deadline |
|
March 16, 2021 |
Notification of Acceptance/Rejection |
|
April 01, 2021 |
Final Paper (Camera Ready) Submission & Early Bird Registration Deadline |
|
October 15, 2022 |
Conference Dates |
|
November 15-16, 2022 |
Margaret Morgan |
University of Ulster, UK |
Dezhi Li |
University of Warwick, UK |
M. Ashraf Khan |
Saginaw Valley State University, US |
Vibhash Jha |
NXP Semiconductors, US |
Vardhini Catari Catari |
Taylor Business Institute, US |
Joseph Prabhakar Williams |
Sri Indu College of Engineering and Technology, IN |
Amer Shebani |
Zawiya College of Computer, LY |
Nelidya Md Yusoff |
University of Technology, Malaysia, MY |
Nurul Farahin Mohd Joharudin |
Tun Hussein Onn University of Malaysia, MY |
Edgar Andres Parra Ricaurte |
Technical University of Madrid, ES |
Shyamkumar Kalpande |
Guru Gobind Singh College of Engineering and Research Centre, IN |
Naveen Aggarwal |
Technocrats Institute of Technology, Bhopal, MP, India, IN |
Kottala Sriyogi |
Guru Ghasidas Vishwavidyalaya, IN |
Vijay Kumar |
IIMT College of Engineering, IN |
Saumyaranjan Sahoo |
Pandit Deendayal Petroleum University, IN |
Mohamad Sazali Said |
University Kuala Lumpur Malaysian Spanish Institute, Malaysia |
Redha Elhuni |
Libyan Petroleum Institute (LPI), Libya |
Waheb Abdullah |
University Malaysia Pahang, MY |
Yousef Amer |
University of South Australia , AU |
Zoltan Weltsch |
Kecskemét College, Hungary |
Ahmad Forouzan Tabar |
Islamic Azad University, Marvdasht Branch, Iran, Islamic Republic Of |
Georgenyori Makari |
University of Nairobi, KE |
Ahmed Boutejdar |
German Resarch Foundation, DFG, Bonn-Braunschweig, DE |
Sachin Salunkhe |
Vel Tech Rangarajan Dr. Sagunthala R&D Institute of Science and Technology, IN |
Waleed Ahmed |
Suez Canal University, EG |
Palanisamy Sivaprakash |
A. S. L. Pauls College of Engineering and Technology, IN |
Srinivasulu Avireni |
Vignan's University, IN |
Afrooz Moatari Kazerouni |
Ecole Polytechnique de Montreal, CA |
Naveen Beri |
Beant College of Engineering & Technology, Gurdaspur, INDIA, IN |
Muhammad Fahad |
NED University, PK |
Participation Type |
Early Registration Ticket Fees |
Registration Ticket Fees |
Non-Student Oral/Poster Presenter Registration |
€ 450 |
€ 500 |
Student Oral/Poster Presenter Registration |
€ 350 |
€ 400 |
Listener Registration |
€ 250 |
€ 300 |
Additional Paper Publication |
€ 100 |
All conference materials and services will be delivered digitally to the participant with the online conference management system.
Conference registration includes the following digital materials and services:
- e-certificates [for Authors: Certificate of Attendance and Presentation; for Listeners: Certificate of Attendance; for Chairs: Certificate of Attendance and Appreciation; for Presenters: Certificate of Best Presentation (if conferred based appraisal)]
- e-program
- e-book
- e-name badge
- e-receipt
- e-presentation
Presentation Types:
-
Physical presentation is an oral conferencing presentation that is made using digital technology including embedded digital elements ( texts, tables, graphs, or videos ) for PowerPoint sharing.
-
Digital presentation is a digital conferencing presentation that is made using digital technology including embedded digital elements ( texts, tables, graphs, or videos ) for PowerPoint sharing.
Early Bird Registration
Early Bird registration is valid until 2022-10-15 23:59:59
Online Credit Card Processing
Online payment option available for author
and listener delegates.
Conference participants can make online credit card payments for conference registration fees.