International Conference on Electronics Packaging Technology (ICEPT)

International Conference on Electronics Packaging Technology

Electronics Packaging Technology Conference aims to bring together leading academic scientists, researchers and research scholars to exchange and share their experiences and research results on all aspects of Electronics Packaging Technology Conference. It also provides a premier interdisciplinary platform for researchers, practitioners, and educators to present and discuss the most recent innovations, trends, and concerns as well as practical challenges encountered and solutions adopted in the fields of Electronics Packaging Technology Conference.

Upcoming Conferences

HYBRID
New York
October 2025 in New York
  • Conference Code: 25USNE10ICEPT014
  • Abstract/Full-Text Paper Submission: January 15, 2025
  • Notification of Acceptance/Rejection: January 31, 2025
  • Final Paper and Early Bird Registration: September 09, 2025
  • Conference Date: October 07-08, 2025
  • Conference Program
HYBRID
Kuala Lumpur
December 2025 in Kuala Lumpur
  • Conference Code: 25MYKU12ICEPT014
  • Abstract/Full-Text Paper Submission: January 15, 2025
  • Notification of Acceptance/Rejection: January 31, 2025
  • Final Paper and Early Bird Registration: November 05, 2025
  • Conference Date: December 06-07, 2025
  • Conference Program
HYBRID
New York
October 2026 in New York
  • Conference Code: 26USNE10ICEPT014
  • Abstract/Full-Text Paper Submission: February 13, 2025
  • Notification of Acceptance/Rejection: February 27, 2025
  • Final Paper and Early Bird Registration: September 09, 2026
  • Conference Date: October 07-08, 2026
  • Conference Program
HYBRID
Kuala Lumpur
December 2026 in Kuala Lumpur
  • Conference Code: 26MYKU12ICEPT014
  • Abstract/Full-Text Paper Submission: February 13, 2025
  • Notification of Acceptance/Rejection: February 27, 2025
  • Final Paper and Early Bird Registration: November 05, 2026
  • Conference Date: December 06-07, 2026
  • Conference Program