International Conference on Hardware Engineering and Research

Hardware Engineering and Research Conference aims to bring together leading academic scientists, researchers and research scholars to exchange and share their experiences and research results on all aspects of Hardware Engineering and Research Conference. It also provides a premier interdisciplinary platform for researchers, practitioners, and educators to present and discuss the most recent innovations, trends, and concerns as well as practical challenges encountered and solutions adopted in the fields of Hardware Engineering and Research Conference.

Upcoming Conferences

DIGITAL
Kuala Lumpur
February 2022 in Kuala Lumpur
  • Conference Code: 22MY02ICHER005
  • Abstract/Full-Text Paper Submission: November 01, 2021
  • Notification of Acceptance/Rejection: November 15, 2021
  • Final Paper and Early Bird Registration: January 11, 2022
  • Conference Date: February 15-16, 2022
DIGITAL
Miami
March 2022 in Miami
  • Conference Code: 22US03ICHER005
  • Abstract/Full-Text Paper Submission: November 01, 2021
  • Notification of Acceptance/Rejection: November 15, 2021
  • Final Paper and Early Bird Registration: February 11, 2022
  • Conference Date: March 11-12, 2022
Kuala Lumpur
February 2023 in Kuala Lumpur
  • Conference Code: 23MY02ICHER005
  • Abstract/Full-Text Paper Submission: July 01, 2022
  • Notification of Acceptance/Rejection: August 01, 2022
  • Final Paper and Early Bird Registration: January 11, 2023
  • Conference Date: February 11-12, 2023
Miami
March 2023 in Miami
  • Conference Code: 23US03ICHER005
  • Abstract/Full-Text Paper Submission: July 01, 2022
  • Notification of Acceptance/Rejection: August 01, 2022
  • Final Paper and Early Bird Registration: February 11, 2023
  • Conference Date: March 11-12, 2023