The International Research Conference Aims and Objectives
The International Research Conference is a federated organization dedicated to bringing together a significant number of diverse scholarly events for presentation
within the conference program. Events will run over a span of time during the conference depending on the number and length of the presentations.
With its high quality, it provides an exceptional value for students, academics and industry researchers.
ICHEMA 2021: 15. International Conference on High-Entropy Materials and Alloys
aims to bring together leading academic scientists, researchers and research scholars to exchange and share their experiences and research results on all aspects of
High-Entropy Materials and Alloys.
It also provides a premier interdisciplinary platform for researchers, practitioners and educators to present and discuss the most recent innovations,
trends, and concerns as well as practical challenges encountered and solutions adopted in the fields of High-Entropy Materials and Alloys
Call for Contributions
Prospective authors are kindly encouraged to contribute to and help shape the conference through submissions of their research abstracts, papers and e-posters.
Also, high quality research contributions describing original and unpublished results of conceptual, constructive, empirical, experimental, or
theoretical work in all areas of High-Entropy Materials and Alloys are cordially invited for presentation at the conference.
The conference solicits contributions of abstracts, papers and e-posters that address themes and topics of the conference, including figures, tables and references of
novel research materials.
Guidelines for Authors
Please ensure your submission meets the conference's strict guidelines for accepting scholarly papers.
Downloadable versions of the check list for
Full-Text Papers and
Abstract Papers.
Please refer to the
Paper Submission Guideline,
Abstract Submission Guideline and
Author Information
before submitting your paper.
Conference Proceedings
All submitted conference papers will be blind peer reviewed by three competent reviewers.
The peer-reviewed conference proceedings are indexed in the Open Science Index,
Google Scholar,
Semantic Scholar,
Zenedo,
OpenAIRE,
BASE,
WorldCAT,
Sherpa/RoMEO,
and other index databases. Impact Factor Indicators.
Special Journal Issues
ICHEMA 2021 has teamed up with the Special Journal Issue on
High-Entropy Materials and Alloys.
A number of selected high-impact full text papers will also be considered for the special journal issues.
All submitted papers will have the opportunity to be considered for this Special Journal Issue.
The paper selection will be carried out during the peer review process as well as at the conference presentation stage.
Submitted papers must not be under consideration by any other journal or publication.
The final decision for paper selection will be made based on peer review reports by the Guest Editors and the Editor-in-Chief jointly.
Selected full-text papers will be published online free of charge.
Conference Sponsor and Exhibitor Opportunities
The Conference offers the opportunity to become a conference sponsor or exhibitor.
To participate as a sponsor or exhibitor, please download and complete the
Conference Sponsorship Request Form.
Digital Program consists of the e-proceedings book which is available online-only
and includes the conference communications (proceedings abstracts and papers).
Registered participants can access the digitally available conference
proceedings ( and certificates ) by visiting their profile pages.
Advanced characterization techniques
Alloy design in the twenty-first century
Alloy design strategies and future trends in high-entropy alloys
Applications and future directions
Applications of special quasi-random structures to high-entropy alloys
Coatings and thin films
Design of high-entropy alloys
Fabrication routes
High-entropy alloy solid solutions
High-entropy alloys
High-Entropy Ceramic, Coatings, Composites
High-entropy coatings
High-entropy materials
High-entropy metallic glasses
High-temp. And radiation-resistant materials
High-temperature and Radiation-resistance
Innovative Applications
Intermetallics, interstitial compounds and metallic glasses in high-entropy alloys
Materials and Process Development
Materials Characterization
Materials design
Mechanical properties
Metallurgy and Phase Transformation
Microstructures and properties of high-entropy alloys
Modeling of high-entropy alloys
Phase formation rules
Phase selection in high-entropy alloys
Physical metallurgy
Physical metallurgy and solid state physics
Physical, chemical and functional properties
Potential applications and prospects
Prediction of structure and phase transformations
Processing development
Simulations and modeling
Structural and functional properties of high-entropy alloys
Structure and characterization
Structure characterization
Surface and structural stability
Synthesis and processing of high-entropy alloys
Abstracts/Full-Text Paper Submission Deadline |
|
February 15, 2021 |
Notification of Acceptance/Rejection |
|
March 01, 2021 |
Final Paper (Camera Ready) Submission & Early Bird Registration Deadline |
|
February 11, 2021 |
Conference Dates |
|
March 22-23, 2021 |
You Lu |
Schlumberger, US |
Jay Prakash Dubey |
Dr. K. N. Modi University, Newai, IN |
Seyedeh Mozhgan Seyed-Talebi |
Shahid Rajaee University, IR |
Inas Battisha |
National Research Center, EG |
Marios Kazasidis |
Trinity College Dublin, IE |
Noor Hasan |
University of Technology, Iraq, IQ |
Mahmoud Sayed Abd El-Sadek |
South Valley University, EG |
Hemant Borkar |
IIT Indore, IN |
Rafal Michalski |
Laboratory Head. 'Atomic Matters' division, PL |
Veera Madhava Rao Mora |
Osmania University, IN |
Suresh Kumar |
Kurukshetra University, IN |
Adel H. Omran Alkhayatt |
University of Kufa, IQ |
Arthur Ekpekpo |
Delta State University, NG |
Avinash Chandra |
Thapar Institute of Engineering and Technology, IN |
Majid Pouranvari |
Islamic Azad University Dezful Branch, IR |
Mustafa Yadegari |
University of Guilan, IR |
Ossama El-Shazly |
Alexandria University, EG |
Preeti Singh Bahadur |
Barkatullah University, IN |
Omar Abd Elkader |
King Saud University, SA |
Ramkrishna Sen |
Indian Institute of Technology Kharagpur, IN |
Meena Laad |
Symbiosis International University, IN |
nor zaihar yahaya |
universiti teknologi petronas, MY |
Mukeshkumar Jotani |
Bhavans Sheth R. A. College of Science, IN |
Ankita Sharma |
Jaipur National University, IN |
Shailendra Kumar Tiwary |
Jabalpur Engineering College, IN |
Veena Khilnani |
K.J.Somaiya College of Science and Commerce, IN |
Fazal Noorbasha |
KL University, IN |
Surendra Poonia |
Central Arid Zone Research Institute, IN |
Rabea Kershi |
Ibb university, YE |
Iraj Kazeminezhad |
Shahid Chamran University, IR |
Participation Type |
Early Registration Ticket Fees |
Registration Ticket Fees |
Non-Student Oral/Poster Presenter Registration |
€ 350 |
€ 400 |
Student Oral/Poster Presenter Registration |
€ 300 |
€ 350 |
Listener Registration |
€ 250 |
€ 300 |
Additional Paper Publication |
€ 100 |
All conference materials and services will be delivered digitally to the participant with the online conference management system.
Conference registration includes the following digital materials and services:
- e-certificates [for Authors: Certificate of Attendance and Presentation; for Listeners: Certificate of Attendance; for Chairs: Certificate of Attendance and Appreciation; for Presenters: Certificate of Best Presentation (if conferred based appraisal)]
- e-program
- e-book
- e-name badge
- e-receipt
- e-presentation
Presentation Types:
-
Physical presentation is an oral conferencing presentation that is made using digital technology including embedded digital elements ( texts, tables, graphs, or videos ) for PowerPoint sharing.
-
Digital presentation is a digital conferencing presentation that is made using digital technology including embedded digital elements ( texts, tables, graphs, or videos ) for PowerPoint sharing.
Early Bird Registration
Early Bird registration was valid until 2021-02-11 23:59:59
Online Credit Card Processing
Online payment option available for author
and listener delegates.
Conference participants can make online credit card payments for conference registration fees.