ICIEEP 2024: 18. International Conference on Industrial Engineering and Electronic Packaging

August 26-27, 2024 in Paris, France

Paris

Other Conferences

DIGITAL
Paris
August 2022 in Paris
  • Conference Code: 22FR08ICIEEP001
  • Abstract/Full-Text Paper Submission: June 01, 2022
  • Notification of Acceptance/Rejection: June 15, 2022
  • Final Paper and Early Bird Registration: April 27, 2022
  • Conference Date: August 30-31, 2022
DIGITAL
New York
December 2022 in New York
  • Conference Code: 22US12ICIEEP001
  • Abstract/Full-Text Paper Submission: June 01, 2022
  • Notification of Acceptance/Rejection: June 15, 2022
  • Final Paper and Early Bird Registration: November 11, 2022
  • Conference Date: December 09-10, 2022
Paris
August 2023 in Paris
  • Conference Code: 23FR08ICIEEP001
  • Abstract/Full-Text Paper Submission: July 01, 2022
  • Notification of Acceptance/Rejection: August 01, 2022
  • Final Paper and Early Bird Registration: April 27, 2023
  • Conference Date: August 26-27, 2023
New York
December 2023 in New York
  • Conference Code: 23US12ICIEEP001
  • Abstract/Full-Text Paper Submission: July 01, 2022
  • Notification of Acceptance/Rejection: August 01, 2022
  • Final Paper and Early Bird Registration: November 11, 2023
  • Conference Date: December 09-10, 2023
New York
December 2024 in New York
  • Conference Code: 24US12ICIEEP001
  • Abstract/Full-Text Paper Submission: August 01, 2023
  • Notification of Acceptance/Rejection: September 04, 2023
  • Final Paper and Early Bird Registration: November 11, 2024
  • Conference Date: December 09-10, 2024