International Conference on Materials Physics and Applications (ICMPA)

International Conference on Materials Physics and Applications

Materials Physics and Applications Conference aims to bring together leading academic scientists, researchers and research scholars to exchange and share their experiences and research results on all aspects of Materials Physics and Applications Conference. It also provides a premier interdisciplinary platform for researchers, practitioners, and educators to present and discuss the most recent innovations, trends, and concerns as well as practical challenges encountered and solutions adopted in the fields of Materials Physics and Applications Conference.

Upcoming Conferences

DIGITAL
Singapore
March 2026 in Singapore
  • Conference Code: 26SGSI03ICMPA011
  • Abstract/Full-Text Paper Submission: May 29, 2025
  • Notification of Acceptance/Rejection: June 12, 2025
  • Final Paper and Early Bird Registration: February 28, 2026
  • Conference Date: March 30-31, 2026
  • Conference Program
DIGITAL
Paris
May 2026 in Paris
  • Conference Code: 26FRPA05ICMPA011
  • Abstract/Full-Text Paper Submission: May 29, 2025
  • Notification of Acceptance/Rejection: June 12, 2025
  • Final Paper and Early Bird Registration: April 16, 2026
  • Conference Date: May 11-12, 2026
  • Conference Program
HYBRID
Singapore
March 2027 in Singapore
  • Conference Code: 27SGSI03ICMPA011
  • Abstract/Full-Text Paper Submission: February 13, 2026
  • Notification of Acceptance/Rejection: February 27, 2026
  • Final Paper and Early Bird Registration: February 28, 2027
  • Conference Date: March 29-30, 2027
  • Conference Program
HYBRID
Paris
May 2027 in Paris
  • Conference Code: 27FRPA05ICMPA011
  • Abstract/Full-Text Paper Submission: February 13, 2026
  • Notification of Acceptance/Rejection: February 27, 2026
  • Final Paper and Early Bird Registration: April 16, 2027
  • Conference Date: May 17-18, 2027
  • Conference Program