The International Research Conference Aims and Objectives
The International Research Conference is a federated organization dedicated to bringing together a significant number of diverse scholarly events for presentation
within the conference program. Events will run over a span of time during the conference depending on the number and length of the presentations.
With its high quality, it provides an exceptional value for students, academics and industry researchers.
International Conference on Microelectronic Engineering and Semiconductor Physics
aims to bring together leading academic scientists, researchers and research scholars to exchange and share their experiences and research results on all aspects of
Microelectronic Engineering and Semiconductor Physics.
It also provides a premier interdisciplinary platform for researchers, practitioners and educators to present and discuss the most recent innovations,
trends, and concerns as well as practical challenges encountered and solutions adopted in the fields of Microelectronic Engineering and Semiconductor Physics.
Call for Contributions
Prospective authors are kindly encouraged to contribute to and help shape the conference through submissions of their research abstracts, papers and e-posters.
Also, high quality research contributions describing original and unpublished results of conceptual, constructive, empirical, experimental, or
theoretical work in all areas of Microelectronic Engineering and Semiconductor Physics are cordially invited for presentation at the conference.
The conference solicits contributions of abstracts, papers and e-posters that address themes and topics of the conference, including figures, tables and references of
novel research materials.
Guidelines for Authors
Please ensure your submission meets the conference's strict guidelines for accepting scholarly papers.
Downloadable versions of the check list for
Full-Text Papers and
Abstract Papers.
Please refer to the
Paper Submission Guideline,
Abstract Submission Guideline and
Author Information
before submitting your paper.
Conference Proceedings
All submitted conference papers will be blind peer reviewed by three competent reviewers.
The peer-reviewed conference proceedings are indexed in the Open Science Index,
Google Scholar,
Semantic Scholar,
Zenedo,
OpenAIRE,
BASE,
WorldCAT,
Sherpa/RoMEO,
and other index databases. Impact Factor Indicators.
Special Journal Issues
18. International Conference on Microelectronic Engineering and Semiconductor Physics has teamed up with the Special Journal Issue on
Microelectronic Engineering and Semiconductor Physics.
A number of selected high-impact full text papers will also be considered for the special journal issues.
All submitted papers will have the opportunity to be considered for this Special Journal Issue.
The paper selection will be carried out during the peer review process as well as at the conference presentation stage.
Submitted papers must not be under consideration by any other journal or publication.
The final decision for paper selection will be made based on peer review reports by the Guest Editors and the Editor-in-Chief jointly.
Selected full-text papers will be published online free of charge.
Conference Sponsor and Exhibitor Opportunities
The Conference offers the opportunity to become a conference sponsor or exhibitor.
To participate as a sponsor or exhibitor, please download and complete the
Conference Sponsorship Request Form.
Conference venue information will be released soon.
Microelectronics, electromagnetics and photonics
Semiconductors for microelectronics and photonics
Microelectronics and photonics
Microelectronics, photonics and nanotechnology
Photonics, micro-electronics, and materials
Engineered materials
Micro- and nanotechnology
Microelectronics
Microelectronics
Photonics
Microelectronics processing and materials
Micro-/nano-engineering / fabrication / technology / manufacturing
Nanoelectronic and photonic devices and their fabrication
Microsystems, microdevices (e.g., sensors and nanoenergy devices) and their fabrication
Microfluidics, life science devices /sensors, as well as integrated lab-on-a-chip and their fabrication
Nanolithography and nanopatterning
Optical lithography
Electron optical methods and systems
X-ray optical methods and systems
Resists
Limits of nanolithography
Nanoimprint lithography
Euv lithography and masks
Charged particle based lithography and patterning
Nanoimprint lithography techniques and templates
Maskless lithography
Emerging nanopatterning methods
Limits of nanopatterning
Pattern transfer
Ion technology
Plasma processing
Transfer of pattern with other methods
Plasma etching
Plasma nanotechnology
Plasma / beam nanopatterning
Plasma surface modification of devices
Wet transfer methods
Materials
Metallization and barrier materials
Silicon on insulators
Dielectrics (low k and high k)
Interconnects
New resist materials
Nanomaterials for device fabrication
Block copolymers
Polymers and flexible substrates
Layered (2d) materials and related transferring techniques
Nanometrology, inspection and testing
Electron beam testers
Laser probes
Signal and image processing
Nanometrology
Afm and scanning probe measurements
Advanced processing and nanofabrication
Process integration
Three dimensional integration
Other / emerging manufacturing and fabrication techniques
3d printing
Rapid thermal processing
Process modelling and simulation
Equipment modelling
Laser assisted processing
Top-down / bottom-up (self-assembly) nanofabrication
Growth, planarization, cleaning techniques for devices
Plasma deposition
Mbe
Other growth techniques
Planarization and cleaning techniques
Advanced nanoelectronic, photonic, sensing, energy harvesting, and fluidic devices
Nanoelectronic, optoelectronic and photonic devices
Memristive devices for neuromorphic computing
Steep slope or fast switching devices
Photonic devices
Optoelectronic devices
Dimension-sensitive device properties
Memory devices
Magnetic and spintronic devices
Advanced mos devices
Vacuum nanoelectronics
Flexible / organic / molecular electronics
Organic and molecular electronics
Flexible electronics
Wearable electronics
Paper electronics
Printed electronics
Microdevices, energy harvesting devices and sensors
Physical sensors and actuators
Energy harvesting devices
Micro- and nanofluidics
Valving devices
Pumping devices
Mixing devices
Separation devices
Other miniaturized devices for biology, chemistry, and medicine (sensors and biosensors)
Biosensors
Chemical sensors
Biomimetic properties incorporated into devices
Bioelectronic devices
Micro / nano / bio interface and interconnection devices
Advanced fabrication and characterization for heterogeneous micro and nano systems
Electro-mechanical systems (mems, nems)
Power mems
Rf mems
Moems
Magnetic mems
Optical and photonic systems
Fluidic systems
Pumping / valving systems
Microreactors
Fluidic interfaces and integration
Biosystems
Dna / protein chips
Cell on chip
Organ on chip
Biomimetic properties incorporated into systems
Lab-on-a-chip
Bioanalytic, diagnostic systems
Microseparation, pretreatment systems
On-chip detection systems
Environmental and food monitoring systems
Research and advances in nanoelectronics, nanofabrication, micro-nano systems, and applications
| Abstracts/Full-Text Paper Submission Deadline |
|
August 01, 2023 |
| Notification of Acceptance/Rejection |
|
September 04, 2023 |
| Final Paper (Camera Ready) Submission & Early Bird Registration Deadline |
|
June 18, 2024 |
| Conference Dates |
|
July 19-20, 2024 |
| Participation Type |
Early Registration Ticket Fees |
Registration Ticket Fees |
| Non-Student Oral/Poster Presenter Registration |
€ 450 |
€ 500 |
| Student Oral/Poster Presenter Registration |
€ 350 |
€ 400 |
| Listener Registration |
€ 250 |
€ 300 |
| Additional Paper Publication |
€ 100 |
All conference materials and services will be delivered digitally to the participant with the online conference management system.
Conference registration includes the following digital materials and services:
- e-certificates [for Authors: Certificate of Attendance and Presentation; for Listeners: Certificate of Attendance; for Chairs: Certificate of Attendance and Appreciation; for Presenters: Certificate of Best Presentation (if conferred based appraisal)]
- e-program
- e-book
- e-name badge
- e-receipt
- e-presentation
Presentation Types:
-
Physical presentation is an oral conferencing presentation that is made using digital technology including embedded digital elements ( texts, tables, graphs, or videos ) for PowerPoint sharing.
-
Digital presentation is a digital conferencing presentation that is made using digital technology including embedded digital elements ( texts, tables, graphs, or videos ) for PowerPoint sharing.
Early Bird Registration
Early Bird registration is valid until 2024-06-18 23:59:59
Online Credit Card Processing
Online payment option available for author
and listener delegates.
Conference participants can make online credit card payments for conference registration fees.
