ICSAMEA 2023: 17. International Conference on Self-Assembly Materials and Engineering Applications

April 17-18, 2023 in Tokyo, Japan

DIGITAL
Tokyo

Other Conferences

DIGITAL
Paris
January 2023 in Paris
  • Conference Code: 23FR01ICSAMEA001
  • Abstract/Full-Text Paper Submission: August 16, 2022
  • Notification of Acceptance/Rejection: August 31, 2022
  • Final Paper and Early Bird Registration: December 24, 2022
  • Conference Date: January 23-24, 2023
Paris
January 2024 in Paris
  • Conference Code: 24FR01ICSAMEA001
  • Abstract/Full-Text Paper Submission: August 01, 2023
  • Notification of Acceptance/Rejection: September 04, 2023
  • Final Paper and Early Bird Registration: December 24, 2023
  • Conference Date: January 25-26, 2024
Tokyo
April 2024 in Tokyo
  • Conference Code: 24JP04ICSAMEA001
  • Abstract/Full-Text Paper Submission: August 01, 2023
  • Notification of Acceptance/Rejection: September 04, 2023
  • Final Paper and Early Bird Registration: March 22, 2024
  • Conference Date: April 22-23, 2024