ICSIM 2024: 18. International Conference on Smart and Intelligent Materials

February 15-16, 2024 in New York, United States

Conference Code: 24USNE02ICSIM005

Submit Your Paper Author Registration Listener Registration

The International Research Conference Aims and Objectives

The International Research Conference is a federated organization dedicated to bringing together a significant number of diverse scholarly events for presentation within the conference program. Events will run over a span of time during the conference depending on the number and length of the presentations. With its high quality, it provides an exceptional value for students, academics and industry researchers.

International Conference on Smart and Intelligent Materials aims to bring together leading academic scientists, researchers and research scholars to exchange and share their experiences and research results on all aspects of Smart and Intelligent Materials. It also provides a premier interdisciplinary platform for researchers, practitioners and educators to present and discuss the most recent innovations, trends, and concerns as well as practical challenges encountered and solutions adopted in the fields of Smart and Intelligent Materials.

Call for Contributions

Prospective authors are kindly encouraged to contribute to and help shape the conference through submissions of their research abstracts, papers and e-posters. Also, high quality research contributions describing original and unpublished results of conceptual, constructive, empirical, experimental, or theoretical work in all areas of Smart and Intelligent Materials are cordially invited for presentation at the conference. The conference solicits contributions of abstracts, papers and e-posters that address themes and topics of the conference, including figures, tables and references of novel research materials.

Guidelines for Authors

Please ensure your submission meets the conference's strict guidelines for accepting scholarly papers. Downloadable versions of the check list for Full-Text Papers and Abstract Papers.

Please refer to the Paper Submission Guideline, Abstract Submission Guideline and Author Information before submitting your paper.

Conference Proceedings

All submitted conference papers will be blind peer reviewed by three competent reviewers. The peer-reviewed conference proceedings are indexed in the Open Science Index, Google Scholar, Semantic Scholar, Zenedo, OpenAIRE, BASE, WorldCAT, Sherpa/RoMEO, and other index databases. Impact Factor Indicators.

Special Journal Issues

18. International Conference on Smart and Intelligent Materials has teamed up with the Special Journal Issue on Smart and Intelligent Materials. A number of selected high-impact full text papers will also be considered for the special journal issues. All submitted papers will have the opportunity to be considered for this Special Journal Issue. The paper selection will be carried out during the peer review process as well as at the conference presentation stage. Submitted papers must not be under consideration by any other journal or publication. The final decision for paper selection will be made based on peer review reports by the Guest Editors and the Editor-in-Chief jointly. Selected full-text papers will be published online free of charge.

Conference Sponsor and Exhibitor Opportunities

The Conference offers the opportunity to become a conference sponsor or exhibitor. To participate as a sponsor or exhibitor, please download and complete the Conference Sponsorship Request Form.

Application Forms

Conference venue information will be released soon.

Non ferrous metal material
Iron and steel
High strength alloys
Materials processing and handling
Composites
Micro/Nano materials
ceramic
Optical, Electronic, Magnetic materials
Carbon based materials
Metallurgical science
Metallurgical fundamentals and techniques
New functional materials
Building materials
New energy materials
Environmental friendly materials
Earthquake materials and design
Biomaterials
Smart and intelligent materials
Intelligent materials systems
Polymeric materials
Thin films
Mechanical behavior and fracture
Tool testing and evaluation of materials
Processing technology for functional materials
Function test and evaluation technology for material analysis

Abstracts/Full-Text Paper Submission Deadline		March 31, 2023
Notification of Acceptance/Rejection		April 13, 2023
Final Paper (Camera Ready) Submission & Early Bird Registration Deadline		January 14, 2024
Conference Dates		February 15-16, 2024

Participation Type	Early Registration Ticket Fees	Registration Ticket Fees
Non-Student Oral/Poster Presenter Registration	€ 450	€ 500
Student Oral/Poster Presenter Registration	€ 350	€ 400
Listener Registration	€ 250	€ 300
Additional Paper Publication	€ 100

All conference materials and services will be delivered digitally to the participant with the online conference management system. Conference registration includes the following digital materials and services:

e-certificates [for Authors: Certificate of Attendance and Presentation; for Listeners: Certificate of Attendance; for Chairs: Certificate of Attendance and Appreciation; for Presenters: Certificate of Best Presentation (if conferred based appraisal)]
e-program
e-book
e-name badge
e-receipt
e-presentation

Presentation Types:

Physical presentation is an oral conferencing presentation that is made using digital technology including embedded digital elements ( texts, tables, graphs, or videos ) for PowerPoint sharing.
Digital presentation is a digital conferencing presentation that is made using digital technology including embedded digital elements ( texts, tables, graphs, or videos ) for PowerPoint sharing.

Early Bird Registration

Early Bird registration is valid until 2024-01-14 23:59:59

Online Credit Card Processing

Online payment option available for author and listener delegates.
Conference participants can make online credit card payments for conference registration fees.