The International Research Conference Aims and Objectives
The International Research Conference is a federated organization dedicated to bringing together a significant number of diverse scholarly events for presentation
within the conference program. Events will run over a span of time during the conference depending on the number and length of the presentations.
With its high quality, it provides an exceptional value for students, academics and industry researchers.
International Conference on Advanced Industrial Engineering and Electronic Packaging Technologies
aims to bring together leading academic scientists, researchers and research scholars to exchange and share their experiences and research results on all aspects of
Advanced Industrial Engineering and Electronic Packaging Technologies.
It also provides a premier interdisciplinary platform for researchers, practitioners and educators to present and discuss the most recent innovations,
trends, and concerns as well as practical challenges encountered and solutions adopted in the fields of Advanced Industrial Engineering and Electronic Packaging Technologies.
Call for Contributions
Prospective authors are kindly encouraged to contribute to and help shape the conference through submissions of their research abstracts, papers and e-posters.
Also, high quality research contributions describing original and unpublished results of conceptual, constructive, empirical, experimental, or
theoretical work in all areas of Advanced Industrial Engineering and Electronic Packaging Technologies are cordially invited for presentation at the conference.
The conference solicits contributions of abstracts, papers and e-posters that address themes and topics of the conference, including figures, tables and references of
novel research materials.
Guidelines for Authors
Please ensure your submission meets the conference's strict guidelines for accepting scholarly papers.
Downloadable versions of the check list for
Full-Text Papers and
Abstract Papers.
Please refer to the
Paper Submission Guideline,
Abstract Submission Guideline and
Author Information
before submitting your paper.
Conference Proceedings
All submitted conference papers will be blind peer reviewed by three competent reviewers.
The peer-reviewed conference proceedings are indexed in the Open Science Index,
Google Scholar,
Semantic Scholar,
Zenedo,
BASE,
WorldCAT,
Sherpa/RoMEO,
and other index databases. Impact Factor Indicators.
Special Journal Issues
19. International Conference on Advanced Industrial Engineering and Electronic Packaging Technologies has teamed up with the Special Journal Issue on
Advanced Industrial Engineering and Electronic Packaging Technologies.
A number of selected high-impact full text papers will also be considered for the special journal issues.
All submitted papers will have the opportunity to be considered for this Special Journal Issue.
The paper selection will be carried out during the peer review process as well as at the conference presentation stage.
Submitted papers must not be under consideration by any other journal or publication.
The final decision for paper selection will be made based on peer review reports by the Guest Editors and the Editor-in-Chief jointly.
Selected full-text papers will be published online free of charge.
Conference Sponsor and Exhibitor Opportunities
The Conference offers the opportunity to become a conference sponsor or exhibitor.
To participate as a sponsor or exhibitor, please download and complete the
Conference Sponsorship Request Form.
Selected Papers
-
Lean Implementation: An Investigation in Successfully Adopting a Lean Philosophy
P. Ahern, D. Collery
-
Bridge Health Monitoring: A Review
Mohammad Bakhshandeh
-
Failure Analysis of a 304 Stainless Steel Flange Crack at Pipeline Transportation of Ethylene
Parisa Hasanpour, Bahram Borooghani, Vahid Asadi
-
Privacy Concerns and Law Enforcement Data Collection to Tackle Domestic and Sexual Violence
Francesca Radice
-
Iron Recovery from Red Mud as Zero-Valent Iron Metal Powder Using Direct Electrochemical Reduction Method
Franky Michael Hamonangan Siagian, Affan Maulana, Himawan Tri Bayu Murti Petrus, Panut Mulyono, Widi Astuti
-
Environmental Impact of Sustainability Dispersion of Chlorine Releases in Coastal Zone of Alexandra: Spatial-Ecological Modeling
Mohammed El Raey, Moustafa Osman Mohammed
-
Static Analysis of Security Issues of the Python Packages Ecosystem
Adam Gorine, Faten Spondon
-
Factors Affecting Test Automation Stability and Their Solutions
Nagmani Lnu
-
Cultural Policies, Globalisation of Arts, and Impact on Cultural Heritage: A Contextual Analysis of France
Nasser AlShawaaf, Soo Hee Lee
-
Enhancing Hand Efficiency of Smart Glass Cleaning Robot through Generative Design Module
Pankaj Gupta, Amit Kumar Srivastava, Nitesh Pandey
-
Influence of Surface Area on Dissolution of Additively Manufactured Polyvinyl Alcohol Tablets
Seyedebrahim Afkhami, Meisam Abdi, Reza Baserinia
-
Development of an Artificial Ear for Bone-Conducted Objective Occlusion Measurement
Yu Luan
-
Uncertainty Multiple Criteria Decision Making Analysis for Stealth Combat Aircraft Selection
C. Ardil
-
AI-Driven Cloud Security: Proactive Defense Against Evolving Cyber Threats
Ashly Joseph
-
Accuracy of Peak Demand Estimates for Office Buildings Using eQUEST
Mahdiyeh Zafaranchi, Ethan S. Cantor, William T. Riddell, Jess W. Everett
Digital Program consists of the e-proceedings book which is available online-only
and includes the conference communications (proceedings abstracts and papers).
Registered participants can access the digitally available conference
proceedings ( and certificates ) by visiting their profile pages.
Industrial robotics and automation
Modeling, analysis and simulation of manufacturing processes
Sensor technology
Advanced forming manufacturing and equipment
Mechanical control and information processing technology
Micro electronic packaging technology and equipment
Surface engineering and coatings
Materials forming
Materials machining
Welding and joining
Computer aided material design
Microwave processing of materials
Thermal engineering theory and applications
High speed precision machining and inspection technology
Micro machining technology
Laser processing technology
Bionic mechanisms and bio manufacturing
Virtual and network manufacturing
Remanufacturing engineering
Sustainable manufacturing technologies
Digital manufacture and management
Quality monitoring and control of the manufacturing process
System analysis and industrial engineering
Production and operation management
Green supply chain
Manufacturing e-commerce system
Abstracts/Full-Text Paper Submission Deadline |
|
November 28, 2024 |
Notification of Acceptance/Rejection |
|
December 12, 2024 |
Final Paper (Camera Ready) Submission & Early Bird Registration Deadline |
|
April 26, 2025 |
Conference Dates |
|
May 29-30, 2025 |