The International Research Conference Aims and Objectives
The International Research Conference is a federated organization dedicated to bringing together a significant number of diverse scholarly events for presentation
within the conference program. Events will run over a span of time during the conference depending on the number and length of the presentations.
With its high quality, it provides an exceptional value for students, academics and industry researchers.
International Conference on Applied Superconductivity and Applications
aims to bring together leading academic scientists, researchers and research scholars to exchange and share their experiences and research results on all aspects of
Applied Superconductivity and Applications.
It also provides a premier interdisciplinary platform for researchers, practitioners and educators to present and discuss the most recent innovations,
trends, and concerns as well as practical challenges encountered and solutions adopted in the fields of Applied Superconductivity and Applications.
Call for Contributions
Prospective authors are kindly encouraged to contribute to and help shape the conference through submissions of their research abstracts, papers and e-posters.
Also, high quality research contributions describing original and unpublished results of conceptual, constructive, empirical, experimental, or
theoretical work in all areas of Applied Superconductivity and Applications are cordially invited for presentation at the conference.
The conference solicits contributions of abstracts, papers and e-posters that address themes and topics of the conference, including figures, tables and references of
novel research materials.
Guidelines for Authors
Please ensure your submission meets the conference's strict guidelines for accepting scholarly papers.
Downloadable versions of the check list for
Full-Text Papers and
Abstract Papers.
Please refer to the
Paper Submission Guideline,
Abstract Submission Guideline and
Author Information
before submitting your paper.
Conference Proceedings
All submitted conference papers will be blind peer reviewed by three competent reviewers.
The peer-reviewed conference proceedings are indexed in the Open Science Index,
Google Scholar,
Semantic Scholar,
Zenedo,
BASE,
WorldCAT,
Sherpa/RoMEO,
and other index databases. Impact Factor Indicators.
Special Journal Issues
19. International Conference on Applied Superconductivity and Applications has teamed up with the Special Journal Issue on
Applied Superconductivity and Applications.
A number of selected high-impact full text papers will also be considered for the special journal issues.
All submitted papers will have the opportunity to be considered for this Special Journal Issue.
The paper selection will be carried out during the peer review process as well as at the conference presentation stage.
Submitted papers must not be under consideration by any other journal or publication.
The final decision for paper selection will be made based on peer review reports by the Guest Editors and the Editor-in-Chief jointly.
Selected full-text papers will be published online free of charge.
Conference Sponsor and Exhibitor Opportunities
The Conference offers the opportunity to become a conference sponsor or exhibitor.
To participate as a sponsor or exhibitor, please download and complete the
Conference Sponsorship Request Form.
Digital Program consists of the e-proceedings book which is available online-only
and includes the conference communications (proceedings abstracts and papers).
Registered participants can access the digitally available conference
proceedings ( and certificates ) by visiting their profile pages.
Applied superconductivity
Superconducting electronics
Device fabrication: junctions, nanowires, epitaxial films, low-loss dielectrics
Packaging and systems integration
Digital circuits: conventional and energy efficient designs
Mixed signal circuits
Microwave devices and components: low-noise amplifiers, mixers, filters
Novel electronics: mesoscopics, topological circuits, metrology, metamaterials
Superconducting detectors
Transition-edge sensors (TES) devices
Nanowire single-photon detectors
Other equilibrium (thermal) detectors: SNS, penetration-depth
Other non-equilibrium (non-thermal) detectors: SIS/HEB mixers, STJ/MKID photon
Instrumentation and readout of superconducting detectors
Large superconducting and related systems
Large detector arrays
Superconducting RF
Levitation, transportation, and propulsion
Magnetic separation and other applications
Cryogenics for superconducting devices and system integration
Superconducting magnets
Accelerator magnets: dipoles, quadrupoles, correctors
Accelerator magnets: wigglers, undulators, special magnets
Fusion magnets
Very high field and NMR magnets
Magnets for medical systems
Detector Magnets
HTS magnets
Magnet stability, magnetization effects, AC losses and protection
Cables (HTS, LTS), CICC, and current leads
Magnet design and analysis techniques
Superconducting electric power
Grid study with superconducting devices
Motors, generators, and other rotating machines
Transmission and distribution cables and links
Transformers
Fault current limiters
Energy storage
AC loss in superconducting electrical power devices
Measurement and testing
Measurement and experimental techniques
Test facilities and instrumentation
Materials important for applications - structure, formation, basic properties
General superconductor materials science
Metals and simple compounds
Cuprates and related materials (buffers, templates, etc.)
Pnictides and related materials
New and emerging materials including Fechalcogenides
Artificial structures, thin films, and multilayers
Insulation and dielectrics
Ancillary materials for superconducting applications
Properties important for applications
Critical current and flux pinning
Magnetization and time-dependent losses
Mechanical properties, strain dependence
Critical temperature and critical fields
| Abstracts/Full-Text Paper Submission Deadline |
|
November 28, 2024 |
| Notification of Acceptance/Rejection |
|
December 12, 2024 |
| Final Paper (Camera Ready) Submission & Early Bird Registration Deadline |
|
March 16, 2025 |
| Conference Dates |
|
April 10-11, 2025 |
