The International Research Conference Aims and Objectives
The International Research Conference is a federated organization dedicated to bringing together a significant number of diverse scholarly events for presentation
within the conference program. Events will run over a span of time during the conference depending on the number and length of the presentations.
With its high quality, it provides an exceptional value for students, academics and industry researchers.
International Conference on Integrated Circuit Design and Technology
aims to bring together leading academic scientists, researchers and research scholars to exchange and share their experiences and research results on all aspects of
Integrated Circuit Design and Technology.
It also provides a premier interdisciplinary platform for researchers, practitioners and educators to present and discuss the most recent innovations,
trends, and concerns as well as practical challenges encountered and solutions adopted in the fields of Integrated Circuit Design and Technology.
Call for Contributions
Prospective authors are kindly encouraged to contribute to and help shape the conference through submissions of their research abstracts, papers and e-posters.
Also, high quality research contributions describing original and unpublished results of conceptual, constructive, empirical, experimental, or
theoretical work in all areas of Integrated Circuit Design and Technology are cordially invited for presentation at the conference.
The conference solicits contributions of abstracts, papers and e-posters that address themes and topics of the conference, including figures, tables and references of
novel research materials.
Guidelines for Authors
Please ensure your submission meets the conference's strict guidelines for accepting scholarly papers.
Downloadable versions of the check list for
Full-Text Papers and
Abstract Papers.
Please refer to the
Paper Submission Guideline,
Abstract Submission Guideline and
Author Information
before submitting your paper.
Conference Proceedings
All submitted conference papers will be blind peer reviewed by three competent reviewers.
The peer-reviewed conference proceedings are indexed in the Open Science Index,
Google Scholar,
Semantic Scholar,
Zenedo,
BASE,
WorldCAT,
Sherpa/RoMEO,
and other index databases. Impact Factor Indicators.
Special Journal Issues
20. International Conference on Integrated Circuit Design and Technology has teamed up with the Special Journal Issue on
Integrated Circuit Design and Technology.
A number of selected high-impact full text papers will also be considered for the special journal issues.
All submitted papers will have the opportunity to be considered for this Special Journal Issue.
The paper selection will be carried out during the peer review process as well as at the conference presentation stage.
Submitted papers must not be under consideration by any other journal or publication.
The final decision for paper selection will be made based on peer review reports by the Guest Editors and the Editor-in-Chief jointly.
Selected full-text papers will be published online free of charge.
Conference Sponsor and Exhibitor Opportunities
The Conference offers the opportunity to become a conference sponsor or exhibitor.
To participate as a sponsor or exhibitor, please download and complete the
Conference Sponsorship Request Form.
Selected Papers
-
Digital Twins: Towards an Overarching Framework for the Built Environment
Astrid Bagireanu, Julio Bros-Williamson, Mila Duncheva, John Currie
-
Awareness for Air Pollution Impacts on Lung Cancer in Southern California: A Pilot Study for Designed Smartphone Application
M. Mohammed Raoof, A. Enkhtaivan, H. Aljuaid
-
Land Layout and Urban Design of New Cities in Underdeveloped Areas of China: A Case Study of Xixian New Area
Libin Ouyang
-
Improved Simultaneous Performance in the Time Domain and in the Frequency Domain
Azeddine Ghodbane, David Bensoussan, Maher Hammami
-
Enhancing Hand Efficiency of Smart Glass Cleaning Robot through Generative Design Module
Pankaj Gupta, Amit Kumar Srivastava, Nitesh Pandey
-
PredictionSCMS: The Implementation of an AI-Powered Supply Chain Management System
Ioannis Andrianakis, Vasileios Gkatas, Nikos Eleftheriadis, Alexios Ellinidis, Ermioni Avramidou
-
Optimization of Shale Gas Production by Advanced Hydraulic Fracturing
Fazl Ullah, Rahmat Ullah
-
Modelling and Dimension Analysis of a Multipurpose Convertible Laptop Table Using Autodesk Fusion 360
Nitesh Pandey, Manish Kumar, Pankaj Gupta, Amit Kumar Srivastava
-
The Algorithm to Solve the Extend General Malfatti’s Problem in a Convex Circular Triangle
Ching-Shoei Chiang
-
Towards the Design of a GIS-Linked Agent-Based Model for the Lake Chad Basin Region: Challenges and Opportunities
Stephen Akuma, Isaac Terngu Adom, Evelyn Doofan Akuma
-
Study of the Effect of Rotation on the Deformation of a Flexible Blade Rotor
Aref Maalej, Marwa Fakhfakh, Wael Ben Amira
-
Utilizing Taguchi Experimental Design for Optimizing Effective Parameters in Tire Vulcanization
Ipak Torkpour
-
Exploring the Landscape of Information Visualization through a Mark Lombardi Lens
Alon Friedman, Antonio Sánchez Chinchón
-
Work System Design in Productivity for Small and Medium Enterprises: A Systematic Literature Review
S. Halofaki, D. R. Seenivasagam, P. Bijay, K. Singh, R. Ananthanarayanan
-
Improving Urban Mobility: Analyzing Impacts of Connected and Automated Vehicles on Traffic and Emissions
Saad Roustom, Hajo Ribberink
Conference venue information will be released soon.
Advanced materials and processing technologies
Advanced transistor and interconnect structures
Three-dimensional (3D) integration
Variation-tolerant designs
Process and design techniques for soft errors, plasma-induced damage, and reliability
Advanced memory devices and circuits
RF, analog, mixed signal, and I/O circuits for future technology generations
Simulation and modeling of advanced processes, devices, and circuits
EDA and design optimizations across system, circuit, and/or device levels for high performance, energy efficiency, yield, and/or reliability
Design for manufacturing, yield, and test
System-on-Chip (SoC) and system-in-package (SiP) design integration
Power semiconductor technologies and circuits
Emerging technologies and circuits
Abstracts/Full-Text Paper Submission Deadline |
|
February 13, 2025 |
Notification of Acceptance/Rejection |
|
February 27, 2025 |
Final Paper (Camera Ready) Submission & Early Bird Registration Deadline |
|
September 07, 2026 |
Conference Dates |
|
October 07-08, 2026 |