The International Research Conference Aims and Objectives
The International Research Conference is a federated organization dedicated to bringing together a significant number of diverse scholarly events for presentation
within the conference program. Events will run over a span of time during the conference depending on the number and length of the presentations.
With its high quality, it provides an exceptional value for students, academics and industry researchers.
International Conference on Microelectronics and Microsystems Technology
aims to bring together leading academic scientists, researchers and research scholars to exchange and share their experiences and research results on all aspects of
Microelectronics and Microsystems Technology.
It also provides a premier interdisciplinary platform for researchers, practitioners and educators to present and discuss the most recent innovations,
trends, and concerns as well as practical challenges encountered and solutions adopted in the fields of Microelectronics and Microsystems Technology.
Call for Contributions
Prospective authors are kindly encouraged to contribute to and help shape the conference through submissions of their research abstracts, papers and e-posters.
Also, high quality research contributions describing original and unpublished results of conceptual, constructive, empirical, experimental, or
theoretical work in all areas of Microelectronics and Microsystems Technology are cordially invited for presentation at the conference.
The conference solicits contributions of abstracts, papers and e-posters that address themes and topics of the conference, including figures, tables and references of
novel research materials.
Guidelines for Authors
Please ensure your submission meets the conference's strict guidelines for accepting scholarly papers.
Downloadable versions of the check list for
Full-Text Papers and
Abstract Papers.
Please refer to the
Paper Submission Guideline,
Abstract Submission Guideline and
Author Information
before submitting your paper.
Conference Proceedings
All submitted conference papers will be blind peer reviewed by three competent reviewers.
The peer-reviewed conference proceedings are indexed in the Open Science Index,
Google Scholar,
Semantic Scholar,
Zenedo,
BASE,
WorldCAT,
Sherpa/RoMEO,
and other index databases. Impact Factor Indicators.
Special Journal Issues
19. International Conference on Microelectronics and Microsystems Technology has teamed up with the Special Journal Issue on
Microelectronics and Microsystems Technology.
A number of selected high-impact full text papers will also be considered for the special journal issues.
All submitted papers will have the opportunity to be considered for this Special Journal Issue.
The paper selection will be carried out during the peer review process as well as at the conference presentation stage.
Submitted papers must not be under consideration by any other journal or publication.
The final decision for paper selection will be made based on peer review reports by the Guest Editors and the Editor-in-Chief jointly.
Selected full-text papers will be published online free of charge.
Conference Sponsor and Exhibitor Opportunities
The Conference offers the opportunity to become a conference sponsor or exhibitor.
To participate as a sponsor or exhibitor, please download and complete the
Conference Sponsorship Request Form.
Selected Papers
-
Failure Analysis of a 304 Stainless Steel Flange Crack at Pipeline Transportation of Ethylene
Parisa Hasanpour, Bahram Borooghani, Vahid Asadi
-
Alcohols as a Phase Change Material with Excellent Thermal Storage Properties in Buildings
Dehong Li, Yuchen Chen, Alireza Kaboorani, Denis Rodrigue, Xiaodong (Alice) Wang
-
Critical Properties of Charged Filter Membranes for Their Applications in Filtration
S. Bokka
-
Metrology-Inspired Methods to Assess the Biases of Artificial Intelligence Systems
Belkacem Laimouche
-
The European Legislation on End-of-Waste
Claudio D'Alonzo
-
Sustainable Reinforcement: Investigating the Mechanical Properties of Concrete with Recycled Aggregates and Sisal Fibers
Salahaldein Alsadey, Issa Amaish
-
Challenges and Proposed Solutions toward Successful Dealing with E-Waste in Kuwait
Salem Alajmi, Bader Altaweel
-
Design of Quality Assessment System for On-Orbit 3D Printing Based on 3D Reconstruction Technology
Jianning Tang, Xiaofeng Wu
-
Supervisory Controller with Three-State Energy Saving Mode for Induction Motor in Fluid Transportation
O. S. Ebrahim, K. O. Shawky, M. O. Ebrahim, P. K. Jain
-
Evaluation of Video Quality Metrics and Performance Comparison on Contents Taken from Most Commonly Used Devices
Pratik Dhabal Deo, Manoj P.
-
Experimental Investigation on the Lithium-ion Battery Thermal Management System Based on U-Shaped Micro Heat Pipe Array in High Temperature Environment
Ruyang Ren, Yaohua Zhao, Yanhua Diao
-
Methodology for Bioenergy Potential and Assessment for Energy Deployment in Rural Vhembe District Areas
Clement M. Matasane, Mohamed T. Kahn
-
Stochastic Edge Based Anomaly Detection for Supervisory Control and Data Acquisitions Systems: Considering the Zambian Power Grid
Lukumba Phiri, Simon Tembo, Kumbuso Joshua Nyoni
-
The Future of Hospitals: A Systematic Review in the Field of Architectural Design with a Disruptive Research and Development Approach
María Araya Léon, Ainoa Abella, Aura Murillo, Ricardo Guasch, Laura Clèries
-
Structural and Optical Properties of CdSiP2 and CdSiAs2 Nonlinear Optical Materials
N. N. Omehe
Digital Program consists of the e-proceedings book which is available online-only
and includes the conference communications (proceedings abstracts and papers).
Registered participants can access the digitally available conference
proceedings ( and certificates ) by visiting their profile pages.
Microelectronics and Microsystems Technology
3D/Heterogeneous Integration
Build Up/Blind and Buried Via PWBs
Cu Pillars and Posts
MCM/SiP Advances
Module Stacking Origami Flex Packages
Package on Package (PoP) Shaped Circuits
Thru Si Vias (TSV)
Emerging Technologies
Advanced Connectors
Embedded Assembly
Interposer Technologies
Thermal Management
Printed Electronics
Wearable Electronics
Structural Electronics
Green Electronics
Environmental Impact Analysis
Green Manufacturing
Large Area/Module Assembly
Photovoltaics
Power Control/Conversion/Distribution
Power Packaging
Solar Thermal Conversion
High Performance Low I/O
Chip on Glass (CoG)
Compact Florescent Systems
Display Drivers
Flat Panel Processes
LED Packaging and Assembly
Lighting and Displays OLED Developments
MEMS/MOEMS
Material Advances
Connections
Integrated Passive Devices
Interconnect Taxonomy
Interface Metallurgy
Phosphors and Light Absorption
Thermal Interface Materials
Thin and Thick Film Systems
Strategic Direction/ Industry Roadmaps
Economics and Cost Analysis
Health and Prognostics
Manufacturing Management and Control
Penetration Strategies
Supply Chain and Operations Management
Technology Drivers
Trends, Forecasts and Roadmaps
Reliability, Health/Prognostics
Failure Analysis
Quality Assessment
Reliability Physics
Test and Measurement
Yield Projection
Nanotechnology
Materials
Processes and Handling
Abstracts/Full-Text Paper Submission Deadline |
|
November 28, 2024 |
Notification of Acceptance/Rejection |
|
December 12, 2024 |
Final Paper (Camera Ready) Submission & Early Bird Registration Deadline |
|
March 08, 2025 |
Conference Dates |
|
March 03-04, 2025 |