The International Research Conference Aims and Objectives
The International Research Conference is a federated organization dedicated to bringing together a significant number of diverse scholarly events for presentation
within the conference program. Events will run over a span of time during the conference depending on the number and length of the presentations.
With its high quality, it provides an exceptional value for students, academics and industry researchers.
International Conference on Microfabrication, Integration and Packaging
aims to bring together leading academic scientists, researchers and research scholars to exchange and share their experiences and research results on all aspects of
Microfabrication, Integration and Packaging.
It also provides a premier interdisciplinary platform for researchers, practitioners and educators to present and discuss the most recent innovations,
trends, and concerns as well as practical challenges encountered and solutions adopted in the fields of Microfabrication, Integration and Packaging.
Call for Contributions
Prospective authors are kindly encouraged to contribute to and help shape the conference through submissions of their research abstracts, papers and e-posters.
Also, high quality research contributions describing original and unpublished results of conceptual, constructive, empirical, experimental, or
theoretical work in all areas of Microfabrication, Integration and Packaging are cordially invited for presentation at the conference.
The conference solicits contributions of abstracts, papers and e-posters that address themes and topics of the conference, including figures, tables and references of
novel research materials.
Guidelines for Authors
Please ensure your submission meets the conference's strict guidelines for accepting scholarly papers.
Downloadable versions of the check list for
Full-Text Papers and
Abstract Papers.
Please refer to the
Paper Submission Guideline,
Abstract Submission Guideline and
Author Information
before submitting your paper.
Conference Proceedings
All submitted conference papers will be blind peer reviewed by three competent reviewers.
The peer-reviewed conference proceedings are indexed in the Open Science Index,
Google Scholar,
Semantic Scholar,
Zenedo,
BASE,
WorldCAT,
Sherpa/RoMEO,
and other index databases. Impact Factor Indicators.
Special Journal Issues
20. International Conference on Microfabrication, Integration and Packaging has teamed up with the Special Journal Issue on
Microfabrication, Integration and Packaging.
A number of selected high-impact full text papers will also be considered for the special journal issues.
All submitted papers will have the opportunity to be considered for this Special Journal Issue.
The paper selection will be carried out during the peer review process as well as at the conference presentation stage.
Submitted papers must not be under consideration by any other journal or publication.
The final decision for paper selection will be made based on peer review reports by the Guest Editors and the Editor-in-Chief jointly.
Selected full-text papers will be published online free of charge.
Conference Sponsor and Exhibitor Opportunities
The Conference offers the opportunity to become a conference sponsor or exhibitor.
To participate as a sponsor or exhibitor, please download and complete the
Conference Sponsorship Request Form.
Selected Papers
-
Lean Implementation: An Investigation in Successfully Adopting a Lean Philosophy
P. Ahern, D. Collery
-
Failure Analysis of a 304 Stainless Steel Flange Crack at Pipeline Transportation of Ethylene
Parisa Hasanpour, Bahram Borooghani, Vahid Asadi
-
Alcohols as a Phase Change Material with Excellent Thermal Storage Properties in Buildings
Dehong Li, Yuchen Chen, Alireza Kaboorani, Denis Rodrigue, Xiaodong (Alice) Wang
-
Influence of Surface Area on Dissolution of Additively Manufactured Polyvinyl Alcohol Tablets
Seyedebrahim Afkhami, Meisam Abdi, Reza Baserinia
-
Current Starved Ring Oscillator Image Sensor
Devin Atkin, Orly Yadid-Pecht
-
Critical Properties of Charged Filter Membranes for Their Applications in Filtration
S. Bokka
-
Modelling and Dimension Analysis of a Multipurpose Convertible Laptop Table Using Autodesk Fusion 360
Nitesh Pandey, Manish Kumar, Pankaj Gupta, Amit Kumar Srivastava
-
Tool Wear Analysis in 3D Manufactured Ti6Al4V
David Downey
-
Metrology-Inspired Methods to Assess the Biases of Artificial Intelligence Systems
Belkacem Laimouche
-
The European Legislation on End-of-Waste
Claudio D'Alonzo
-
Sustainable Reinforcement: Investigating the Mechanical Properties of Concrete with Recycled Aggregates and Sisal Fibers
Salahaldein Alsadey, Issa Amaish
-
Microfluidic Manipulation for Biomedical and Biohealth Applications
Reza Hadjiaghaie Vafaie, Sevda Givtaj
-
Modelling and Enhancing Engineering Drawing and Design Table Design by Analyzing Stress and Advanced Deformation Analysis Using Finite Element Method
Nitesh Pandey, Manish Kumar, Amit Kumar Srivastava, Pankaj Gupta
-
Prediction Study of a Corroded Pressure Vessel Using Evaluation Measurements and Finite Element Analysis
Ganbat Danaa, Chuluundorj Puntsag
-
Challenges and Proposed Solutions toward Successful Dealing with E-Waste in Kuwait
Salem Alajmi, Bader Altaweel
Conference venue information will be released soon.
Microfabrication, Integration and Packaging
Integrated processes (micromachining, micromolding)
Process integration between MEMS and electronics
Microlithography issues unique to MEMS/MOEMS
Manufacturing
Materials
Assembly technologies
Packaging for harsh environments
MOEMS packaging
RF and microwave packaging
Test structures
Devices and components (sensors, actuators)
Dimensional measurements
Physical measurements
Failure analysis
Reliability
Characterization
Process monitoring
Non destructive evaluation
Abstracts/Full-Text Paper Submission Deadline |
|
February 13, 2025 |
Notification of Acceptance/Rejection |
|
February 27, 2025 |
Final Paper (Camera Ready) Submission & Early Bird Registration Deadline |
|
April 19, 2026 |
Conference Dates |
|
May 20-21, 2026 |