The International Research Conference Aims and Objectives
The International Research Conference is a federated organization dedicated to bringing together a significant number of diverse scholarly events for presentation
within the conference program. Events will run over a span of time during the conference depending on the number and length of the presentations.
With its high quality, it provides an exceptional value for students, academics and industry researchers.
International Conference on Microlectronics, Electronic Components, Materials and Technology
aims to bring together leading academic scientists, researchers and research scholars to exchange and share their experiences and research results on all aspects of
Microlectronics, Electronic Components, Materials and Technology.
It also provides a premier interdisciplinary platform for researchers, practitioners and educators to present and discuss the most recent innovations,
trends, and concerns as well as practical challenges encountered and solutions adopted in the fields of Microlectronics, Electronic Components, Materials and Technology.
Call for Contributions
Prospective authors are kindly encouraged to contribute to and help shape the conference through submissions of their research abstracts, papers and e-posters.
Also, high quality research contributions describing original and unpublished results of conceptual, constructive, empirical, experimental, or
theoretical work in all areas of Microlectronics, Electronic Components, Materials and Technology are cordially invited for presentation at the conference.
The conference solicits contributions of abstracts, papers and e-posters that address themes and topics of the conference, including figures, tables and references of
novel research materials.
Guidelines for Authors
Please ensure your submission meets the conference's strict guidelines for accepting scholarly papers.
Downloadable versions of the check list for
Full-Text Papers and
Abstract Papers.
Please refer to the
Paper Submission Guideline,
Abstract Submission Guideline and
Author Information
before submitting your paper.
Conference Proceedings
All submitted conference papers will be blind peer reviewed by three competent reviewers.
The peer-reviewed conference proceedings are indexed in the Open Science Index,
Google Scholar,
Semantic Scholar,
Zenedo,
BASE,
WorldCAT,
Sherpa/RoMEO,
and other index databases. Impact Factor Indicators.
Special Journal Issues
18. International Conference on Microlectronics, Electronic Components, Materials and Technology has teamed up with the Special Journal Issue on
Microlectronics, Electronic Components, Materials and Technology.
A number of selected high-impact full text papers will also be considered for the special journal issues.
All submitted papers will have the opportunity to be considered for this Special Journal Issue.
The paper selection will be carried out during the peer review process as well as at the conference presentation stage.
Submitted papers must not be under consideration by any other journal or publication.
The final decision for paper selection will be made based on peer review reports by the Guest Editors and the Editor-in-Chief jointly.
Selected full-text papers will be published online free of charge.
Conference Sponsor and Exhibitor Opportunities
The Conference offers the opportunity to become a conference sponsor or exhibitor.
To participate as a sponsor or exhibitor, please download and complete the
Conference Sponsorship Request Form.
Selected Papers
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A Study on the Power Control of Wind Energy Conversion System
Mehdi Nafar, Mohammad Reza Mansouri
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Evolution of Web Development Techniques in Modern Technology
Abdul Basit Kiani, Maryam Kiani
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Failure Analysis of a 304 Stainless Steel Flange Crack at Pipeline Transportation of Ethylene
Parisa Hasanpour, Bahram Borooghani, Vahid Asadi
-
A Case Study to Observe How Students’ Perception of the Possibility of Success Impacts Their Performance in Summative Exams
Rochelle Elva
-
Temperature Related Alterations to Mineral Levels and Crystalline Structure in Porcine Long Bone: Intense Heat vs. Open Flame
Caighley Logan, Suzzanne McColl
-
Minimizing Mutant Sets by Equivalence and Subsumption
Samia Alblwi, Amani Ayad
-
Enhancing Hand Efficiency of Smart Glass Cleaning Robot through Generative Design Module
Pankaj Gupta, Amit Kumar Srivastava, Nitesh Pandey
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Digital Content Strategy: Detailed Review of the Key Content Components
Oksana Razina, Shakeel Ahmad, Jessie Qun Ren, Olufemi Isiaq
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Integrated Wastewater Reuse Project of the Faculty of Sciences Ain Chock, Morocco
Nihad Chakri, Btissam El Amrani, Faouzi Berrada, Fouad Amraoui
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Current Starved Ring Oscillator Image Sensor
Devin Atkin, Orly Yadid-Pecht
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Experimental Analysis and Numerical Simulation of Smart Sandwich Beams Behavior in Honeycomb Magnetorheological Elastomer
A. Khebli, S. Aguib, Y. Kateb, L. Guenfoud, N. Chikh, M. Tourab, T. Djedid, W. Dilmi, A. Hadidi, H. Meglouli
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Factors Affecting Test Automation Stability and Their Solutions
Nagmani Lnu
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Analysis of Transformer Reactive Power Fluctuations during Adverse Space Weather
Patience Muchini, Electdom Matandiroya, Emmanuel Mashonjowa
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Investigating the Properties of Asphalt and Asphalt Mixture Based on the Effect of Waste Toner
P. I. Itoua, D. Sun, S. Shen
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Hydrogen-Fueled Micro-Thermophotovoltaic Power Generator: Flame Regimes and Flame Stability
Hosein Faramarzpour
Microlectronics, Electronic Components, Materials and Technology
Silicon Microsystems and MEMS
Thin Film Transistors
Flexible Electronics and Micro/Nano Electronics System Integration and Reliability
Microlectronics, Electronic Components and Technology
Advanced Packaging
3D technologies, embedded, wafer and panel level
packaging, flip chip, advanced substrates, interposers, novel assembly technologies,
fan-out, internet-of-things, bio-compatible, wearables, TSVs, MEMS and sensors,
heterogeneous integration, electronic (power and RF) and optoelectronic packaging
Applied Reliability
System level reliability testing/modeling, reliability test methods
and life models, failure analysis techniques/physics of failure, TSV/3D reliability and
packaging challenges, interconnect reliability, solder and materials characterization, drop
and dynamic mechanical reliability, probabilistic design for reliability (PDfR), automotive
reliability requirements
Assembly and Manufacturing Technology
Advancement of packaging
and manufacturing technologies in large OEMs, innovation in enabling high density
packages including 3D integration, challenges and solutions of mainstream packaging and
manufacturing technologies, challenges and solutions for medical applications
Emerging Technologies
Internet-of-things components: wearable electronics,
flexible and stretchable electronics packaging, compact and autonomous sensor packaging;
bioelectronics packaging: microfluidics and MEMS, bio-sensing packaging, new
materials for bio packaging; power technologies: small form factor packaging, high
power packaging; novel advanced packaging: energy harvesting electronics packaging,
photovoltaic packaging, components for wireless packaging, novel approaches to
packaging; complex packaging: security, redundancy, repair, directed assembly, built-in
test, multifunction integration; emerging packaging concepts and technologies: organic IC
and TFT, anti-counterfeiting packaging
High-Speed, Wireless and Components
Components, modules and novel
packaging technology solutions for high-frequency, high-speed digital, power, and wireless
applications; embedded/integrated chips and passives; signal and power integrity; sensors,
RFID, RF MEMS, low-power RF design, wireless power transfer and energy harvesting;
cutting-edge component/module technologies for power, RF, millimeter-wave and THz
applications; bio/wearable applications, flexible and printed electronics; meta-materials,
magneto-dielectric nano-composites; SiP, heterogeneous integration
Interconnections
First- and second-level interconnections: designs, structures,
processes, performance, reliability (e.g., electromigration), test; technologies including
TSV, interposers (Si, glass, organic), interconnections for 3D integration and SiP, flip chip,
solder bumping and Cu pillar, wafer-level packaging, wafer and panel level fan-out,
advanced wirebonds, non-traditional interconnections (e.g., electrically conductive
adhesives, carbon nano-tubes, graphene, optical), substrates and PCB solutions for next
generation systems, system packaging and heterogeneous integration; topics of special
interest include new applications in wearables, internet-of-things, cloud, and automotive
electronics
Materials and Processing
Adhesives and adhesion, lead free solder, novel materials
and processing; underfills, mold compounds, dielectrics, emerging materials, and
processing for 2D and 3D
Modeling and Simulation
Electrical, thermal and mechanical modeling and simulation,
including: component, board and system level modeling for microelectronics including
3D interconnects (TSV, stacked die), 2.5D packaging (Si interposers), wafer-level
package (WLP), ball grid array (BGA), embedded packages with active and passive
components, system-in-package (SiP), power electronic modules, LED packaging,
MEMS; novel high-speed interconnects and power delivery architectures; fab/thin wafer
handling, wire bonding and assembly manufacture process; reliability modeling related
fracture mechanics, fatigue, electromigration, warpage, delamination/moisture, drop
test, material constitutive relations; novel modeling including multi-scale and multi-physics
techniques and solutions; measurement methodologies and correlations
Optoelectronics
Fiber optical interconnects, single mode or multicore connectors,
parallel optical transceivers, silicon and III-V photonics packaging, optical chip-scale and
heterogeneous integration, micro-optical system integration and photonic system-in-
package, 3D photonics integration, optoelectronic assembly and reliability, materials and
manufacturing technology, high-efficiency LEDs and high power lasers, integrated optical
sensors
