The International Research Conference Aims and Objectives
The International Research Conference is a federated organization dedicated to bringing together a significant number of diverse scholarly events for presentation
within the conference program. Events will run over a span of time during the conference depending on the number and length of the presentations.
With its high quality, it provides an exceptional value for students, academics and industry researchers.
International Conference on Silicon Carbide and Related Materials
aims to bring together leading academic scientists, researchers and research scholars to exchange and share their experiences and research results on all aspects of
Silicon Carbide and Related Materials.
It also provides a premier interdisciplinary platform for researchers, practitioners and educators to present and discuss the most recent innovations,
trends, and concerns as well as practical challenges encountered and solutions adopted in the fields of Silicon Carbide and Related Materials.
Call for Contributions
Prospective authors are kindly encouraged to contribute to and help shape the conference through submissions of their research abstracts, papers and e-posters.
Also, high quality research contributions describing original and unpublished results of conceptual, constructive, empirical, experimental, or
theoretical work in all areas of Silicon Carbide and Related Materials are cordially invited for presentation at the conference.
The conference solicits contributions of abstracts, papers and e-posters that address themes and topics of the conference, including figures, tables and references of
novel research materials.
Guidelines for Authors
Please ensure your submission meets the conference's strict guidelines for accepting scholarly papers.
Downloadable versions of the check list for
Full-Text Papers and
Abstract Papers.
Please refer to the
Paper Submission Guideline,
Abstract Submission Guideline and
Author Information
before submitting your paper.
Conference Proceedings
All submitted conference papers will be blind peer reviewed by three competent reviewers.
The peer-reviewed conference proceedings are indexed in the Open Science Index,
Google Scholar,
Semantic Scholar,
Zenedo,
BASE,
WorldCAT,
Sherpa/RoMEO,
and other index databases. Impact Factor Indicators.
Special Journal Issues
19. International Conference on Silicon Carbide and Related Materials has teamed up with the Special Journal Issue on
Silicon Carbide and Related Materials.
A number of selected high-impact full text papers will also be considered for the special journal issues.
All submitted papers will have the opportunity to be considered for this Special Journal Issue.
The paper selection will be carried out during the peer review process as well as at the conference presentation stage.
Submitted papers must not be under consideration by any other journal or publication.
The final decision for paper selection will be made based on peer review reports by the Guest Editors and the Editor-in-Chief jointly.
Selected full-text papers will be published online free of charge.
Conference Sponsor and Exhibitor Opportunities
The Conference offers the opportunity to become a conference sponsor or exhibitor.
To participate as a sponsor or exhibitor, please download and complete the
Conference Sponsorship Request Form.
Selected Papers
-
Alcohols as a Phase Change Material with Excellent Thermal Storage Properties in Buildings
Dehong Li, Yuchen Chen, Alireza Kaboorani, Denis Rodrigue, Xiaodong (Alice) Wang
-
Critical Properties of Charged Filter Membranes for Their Applications in Filtration
S. Bokka
-
The European Legislation on End-of-Waste
Claudio D'Alonzo
-
Sustainable Reinforcement: Investigating the Mechanical Properties of Concrete with Recycled Aggregates and Sisal Fibers
Salahaldein Alsadey, Issa Amaish
-
Saving Energy through Scalable Architecture
John Lamb, Robert Epstein, Vasundhara L. Bhupathi, Sanjeev Kumar Marimekala
-
Challenges and Proposed Solutions toward Successful Dealing with E-Waste in Kuwait
Salem Alajmi, Bader Altaweel
-
Methodology for Bioenergy Potential and Assessment for Energy Deployment in Rural Vhembe District Areas
Clement M. Matasane, Mohamed T. Kahn
-
Structural and Optical Properties of CdSiP2 and CdSiAs2 Nonlinear Optical Materials
N. N. Omehe
-
A Review on Recycled Materials Used in Construction
Oghenerukome Akponovo, Lynda I. Onyebuchukwu
-
Review of Carbon Materials: Application in Alternative Energy Sources and Catalysis
Marita Pigłowska, Beata Kurc, Maciej Galiński
-
A Modern Review of the Non-Invasive Continuous Blood Glucose Measuring Devices and Techniques for Remote Patient Monitoring System
Muhibul Haque Bhuyan
-
Effects of Asphalt Modification with Nanomaterials on Fresh and Stored Bitumen
Ahmed W. Oda, Ahmed El-Desouky, Hassan Mahdy, Osama M. Moussa
-
Supplementary Cementitious Materials as Sustainable Partial Replacement for Cement in the Building Industry
Nwakaego C. Onyenokporo
-
Comparison and Characterization of Dyneema™ HB-210 and HB-212 for Accelerated UV Aging
Jonmichael A. Weaver, David A. Miller
-
Study on the Influence of Cladding and Finishing Materials of Apartment Buildings on the Architectural Identity of Amman, Jordan
Asil Y. Zureigat, Ayat A. Oudat
Digital Program consists of the e-proceedings book which is available online-only
and includes the conference communications (proceedings abstracts and papers).
Registered participants can access the digitally available conference
proceedings ( and certificates ) by visiting their profile pages.
Fundamentals (Theoretical and Experimental)
SiC Bulk Growth
SiC Epitaxial Growth
New Materials Grown on SiC (e.g. Graphene)
Material Characterization
Defect Engineering
Surfaces and Interfaces
Device Fabrication Processes
Devices (Power Switching Devices, RF Power Devices, High-Temperature Devices, Radiation-Resistant Devices, etc.)
Device Physics (Measurement, Modeling, Simulation and Reliability)
Packaging and Modular Technology
Circuits and Applications
Abstracts/Full-Text Paper Submission Deadline |
|
November 28, 2024 |
Notification of Acceptance/Rejection |
|
December 12, 2024 |
Final Paper (Camera Ready) Submission & Early Bird Registration Deadline |
|
July 22, 2025 |
Conference Dates |
|
August 21-22, 2025 |